Improving the dielectric and piezoelectric properties of screen-printed Low temperature PZT/polymer composite using cold isostatic pressing
Improving the dielectric and piezoelectric properties of screen-printed Low temperature PZT/polymer composite using cold isostatic pressing
复制标题
使用冷等静压改善丝网印刷低温 PZT/聚合物复合材料的介电和压电性能
DOI：
10.1088/1742-6596/557/1/012083
复制
发表时间：
2014
期刊：
影响因子：
--
通讯作者：
Almusallam A
中科院分区：
文献类型：
--
作者：
Almusallam A
本文报道了采用冷等静压工艺(CIP)改善柔性电子设备用丝网印刷PZT/聚合物薄膜的介电和压电性能。采用质量比为12：1的半固化和全固化PZT/聚合物复合浆料，研究了CIP工艺对PZT/聚合物复合浆料压电性能和介电性能的影响。结果表明，半固化和完全固化的薄膜在压力分别为5和10 Mpa时具有最高的介电和压电性能。在1 kHz下测得半固化和完全固化样品的相对介电常数分别为300和245。在未优化的极化条件下，半固化膜和全固化膜的初始d33值分别为30和35pC/N。然后，使用优化的条件对完全固化的样品进行极化，结果显示AD33约为44pC/N，与非CIP加工材料相比增加了7%。
This paper reports an improvement in dielectric and piezoelectric properties of screen-printed PZT/polymer films for flexible electronics applications using Cold Isostatic Pressing (CIP). The investigation involved half and fully cured PZT/polymer composite pastes with weight ratio of 12: 1 to investigate the effect of the CIP process on the piezoelectric and dielectric properties. It was observed that the highest dielectric and piezoelectric properties are achieved at pressures of 5 and 10 MPa for half and fully cured films respectively. The relative dielectric constants were 300 and 245 measured at 1 kHz for the half and fully cured samples. Using unoptimised poling conditions, the initial d33 values were 30 and 35 pC/N for the half and fully cured films, respectively. The fully cured sample was then poled using optimized conditions and demonstrated ad 33 of approximately 44 pC/N which is an increase of 7% compared with non-CIP processed materials.
用于 MEMS 器件的压电聚合物复合材料的表征
影响因子：
1.8
作者：
C. Rao;G. Prasad
通讯作者：
G. Prasad