Effect of joining temperature and holding time on microstructure and shear strength of Ti2AlC/Cu joints brazed using Ag-Cu filler alloy
Effect of joining temperature and holding time on microstructure and shear strength of Ti2AlC/Cu joints brazed using Ag-Cu filler alloy
复制标题
焊接温度和保温时间对Ag-Cu钎料钎焊Ti2AlC/Cu接头显微组织和剪切强度的影响
DOI：
10.1016/j.msea.2012.12.037
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发表时间：
2013-04
期刊：
影响因子：
6.4
通讯作者：
He X. D.
中科院分区：
文献类型：
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作者：
Zhang J.;Wang G. C.;Hea Y. M.;Sun Y.;He X. D.
本研究研究了钎焊温度和保温时间对Ag-Cu钎料在800~900℃钎焊10min并在850℃保温不同时间的Ti2AlC-铜接头显微组织和力学性能的影响。接头的代表性结构是Ti2AlC/Ti2AlC基体中的相互作用区域/钎焊层/铜基体/Cu的扩散区域。钎焊层由富Cu相、AlCu2Ti金属间化合物和Ag[Cu]固溶体组成。随着钎焊温度的升高，更多的钎料渗入陶瓷基体中并与Ti2AlC发生反应，加速Ti2AlC的分解并形成Ti3AlC2、TiC和AlCu2Ti反应相。此外，更多的铜基体溶解到填充合金中；从而在钎焊层中产生更多的富Cu相和AlCu2Ti。此外，钎焊层的宽度减小，而相互作用区和扩散区的宽度增加。随着钎焊温度的升高，剪切接头强度先增大后减小。通过延长保持时间，相互作用区和扩散区的宽度都增加，而钎焊层的宽度保持恒定在约50μm。接头的结构和剪切强度均不受保持时间的影响。将 Ti2AlC 陶瓷与 Ag-Cu 填充合金铜连接的最佳钎焊参数为 850°C，持续 40 分钟。所得接头的最大剪切强度为203.3MPa。
The present study investigated the effect of brazing temperature and holding time on the microstructure and mechanical properties of Ti2AlC-copper joints brazed with Ag-Cu filler alloy at 800–900°C for 10min and held for different times at 850°C. The representative structure of the joints was Ti2AlC/interaction area in the Ti2AlC substrate/brazing layer/diffusion area of the copper substrates/Cu. The brazing layer was composed of Cu-rich phases, AlCu2Ti intermetallic compounds and Ag[Cu] solid solutions. With increasing brazing temperature, more filler alloy was infiltrated into the ceramic substrate and reacted with Ti2AlC, accelerating the decomposition of Ti2AlC and the formation of Ti3AlC2, TiC and AlCu2Ti reaction phases. Moreover, more copper substrate was dissolved into the filler alloy; thus, more Cu-rich phase and AlCu2Ti were produced in the brazing layer. Moreover, the width of the brazing layer was reduced, while the widths of both the interaction area and diffusion area increased. As the brazing temperature was increased, the shear joint strength increased and then decreased. By prolonging the holding time, the widths of both the interaction area and the diffusion area were increased, while the width of the brazing layer was held constant at approximately 50μm. Neither the structure nor the shear strength of the joints was influenced by the holding time. The optimum brazing parameters for joining Ti2AlC ceramic to copper with Ag-Cu filler alloy were 850°C for 40min. The joints obtained exhibit a maximum shear strength of 203.3MPa.
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影响因子：
5.7
作者：
V. Gauthier-Brunet;T. Cabioc’h;P. Chartier;M. Jaouen;S. Dubois
通讯作者：
V. Gauthier-Brunet;T. Cabioc’h;P. Chartier;M. Jaouen;S. Dubois
DOI：
10.1007/bf02647559
发表时间：
1994-08
期刊：
Journal of Phase Equilibria
影响因子：
--
作者：
M. A. Pietzka;J. Schuster
通讯作者：
M. A. Pietzka;J. Schuster
影响因子：
6
作者：
Yulong Li;P. He;Jicai Feng
通讯作者：
Yulong Li;P. He;Jicai Feng
影响因子：
6
作者：
Barsoum, MW;Brodkin, D;ElRaghy, T
通讯作者：
ElRaghy, T
TiAl/Si3N4钎焊接头的界面显微组织及连接性能
DOI：
10.1016/j.msea.2011.05.079
发表时间：
2011-08
影响因子：
6.4
作者：
通讯作者：
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