The microstructure of Ti-Ni-Cu shape memory thin films: a review

The microstructure of Ti-Ni-Cu shape memory thin films: a review
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Ti-Ni-Cu形状记忆薄膜的微观结构:综述

DOI:
10.1080/02670836.2022.2028231
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发表时间:
2022-01
影响因子:
1.8
通讯作者:
Yi Xiaoyang
Yi Xiaoyang
中科院分区:
材料科学3区
文献类型:
--
作者:
Li Jun;Feng Xinxin;Wang Haizhen;Meng Xianglong;Gao Zhiyong;Yi Xiaoyang

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Ti-Ni-Cu形状记忆薄膜由于具有热滞变窄、上级热循环稳定性好、强度高和长期功能疲劳等优点而备受关注。其突出的功能特性与其特定的晶体结构和显微结构特征密切相关。本文综述了等原子、富Ti和富(Ni,Cu)形状记忆薄膜的微观结构。此外,还对无沉淀相和含不同类型沉淀相的Ti-Ni-Cu薄膜的马氏体相变、微观结构和应变恢复特性进行了总结。此外,还对获得优异功能特性的机理进行了讨论和评述,为设计性能优异的Ti-Ni-Cu形状记忆合金薄膜微执行器提供了理论依据。
Ti-Ni-Cu shape memory thin films have attracted more attention as a result of the perfect combination of various advantages such as narrower thermal hysteresis, superior thermal cycling stability, higher strength and long-term functional fatigue. The prominent functional properties were closely related to their specific crystal structure and microstructural features. In the present paper, the microstructure in equiatomic, Ti-rich and (Ni,Cu)-rich shape memory thin films were reviewed. In addition, the corresponding results including martensitic transformation, microstructure and strain recovery characteristics of Ti-Ni-Cu thin films without precipitates and containing different types of precipitates were summarised. Besides, the mechanisms for obtaining the outstanding functional properties are discussed and reviewed, which can offer the theoretical basis to the design of Ti-Ni-Cu shape memory alloy thin film micro actuators with excellent performances.
Al掺杂纳米晶Ti-Ni-Cu形状记忆合金中具有宽温度窗口的巨弹热效应
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