The microstructure of Ti-Ni-Cu shape memory thin films: a review
The microstructure of Ti-Ni-Cu shape memory thin films: a review
复制标题
Ti-Ni-Cu形状记忆薄膜的微观结构:综述
DOI:
10.1080/02670836.2022.2028231
复制
发表时间:
2022-01
影响因子:
1.8
通讯作者:
Yi Xiaoyang
中科院分区:
文献类型:
--
作者:
Li Jun;Feng Xinxin;Wang Haizhen;Meng Xianglong;Gao Zhiyong;Yi Xiaoyang
Ti-Ni-Cu shape memory thin films have attracted more attention as a result of the perfect combination of various advantages such as narrower thermal hysteresis, superior thermal cycling stability, higher strength and long-term functional fatigue. The prominent functional properties were closely related to their specific crystal structure and microstructural features. In the present paper, the microstructure in equiatomic, Ti-rich and (Ni,Cu)-rich shape memory thin films were reviewed. In addition, the corresponding results including martensitic transformation, microstructure and strain recovery characteristics of Ti-Ni-Cu thin films without precipitates and containing different types of precipitates were summarised. Besides, the mechanisms for obtaining the outstanding functional properties are discussed and reviewed, which can offer the theoretical basis to the design of Ti-Ni-Cu shape memory alloy thin film micro actuators with excellent performances.
登录
查看更多内容
影响因子:
9.4
作者:
Hong Chen;Fei Xiao;Xiao Liang;Zhenxing Li;Zhu Li;Xuejun Jin;Takashi Fukuda
通讯作者:
Takashi Fukuda
影响因子:
9.4
作者:
Y. Wu;E. Ertekin;H. Sehitoglu
通讯作者:
Y. Wu;E. Ertekin;H. Sehitoglu
影响因子:
6.2
作者:
Dao-xi Li;Xiaoqing Zhang;Z. Xiong;Y. Mai
通讯作者:
Dao-xi Li;Xiaoqing Zhang;Z. Xiong;Y. Mai
影响因子:
6.2
作者:
Ishida, A.;Sato, M.;Gao, Z. Y.
通讯作者:
Gao, Z. Y.
DOI:
10.1155/2014/987847
发表时间:
2014-01
期刊:
--
影响因子:
--
作者:
M. T. Jan;N. H. Hamid;M. Khir;K. Ashraf;andMohammad Shoaib
通讯作者:
M. T. Jan;N. H. Hamid;M. Khir;K. Ashraf;andMohammad Shoaib