Effects of interfacial properties on the ductility of polymer-supported metal films for flexible electronics
Effects of interfacial properties on the ductility of polymer-supported metal films for flexible electronics
复制标题
界面性质对柔性电子器件聚合物支撑金属薄膜延展性的影响
DOI:
10.1016/j.ijsolstr.2010.03.017
复制
发表时间:
2010-07
影响因子:
3.6
通讯作者:
Wang, F.
中科院分区:
文献类型:
--
作者:
Lu, T. J.;Xu, W.;Wang, F.
Polymer-supported metal films as interconnects for flexible, large area electronics may rupture when they are stretched, and the rupture strain is strongly dependent upon the film/substrate interfacial properties. This paper investigates the influence of interfacial properties on the ductility of polymer-supported metal films by modeling the microstructure of the metal film as well as the film/substrate interface using the method of finite elements and the cohesive zone model (CZM). The influence of various system parameters including substrate thickness, Young’s modulus of substrate material, film/substrate interfacial stiffness, strength and interfacial fracture energy on the ductility of polymer-supported metal films is systematically studied. Obtained results demonstrate that the ductility of polymer-supported metal films increases as the interfacial strength increases, but the increasing trend is affected distinctly by the interfacial stiffness.
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影响因子:
9.4
作者:
B. Sheldon;A. Bhandari;A. Bower;S. Raghavan;X. Weng;J. Redwing
通讯作者:
B. Sheldon;A. Bhandari;A. Bower;S. Raghavan;X. Weng;J. Redwing
影响因子:
5.4
作者:
C. Chow;T. Lu
通讯作者:
C. Chow;T. Lu
DOI:
--
发表时间:
2004-02
期刊:
--
影响因子:
--
作者:
L. Freund;S. Suresh
通讯作者:
L. Freund;S. Suresh
影响因子:
5.3
作者:
J. Tello;A. Bower
通讯作者:
J. Tello;A. Bower
影响因子:
4
作者:
Li, T;Huang, ZY;Wagner, S
通讯作者:
Wagner, S