Effects of interfacial properties on the ductility of polymer-supported metal films for flexible electronics

Effects of interfacial properties on the ductility of polymer-supported metal films for flexible electronics
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界面性质对柔性电子器件聚合物支撑金属薄膜延展性的影响

DOI:
10.1016/j.ijsolstr.2010.03.017
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发表时间:
2010-07
影响因子:
3.6
通讯作者:
Wang, F.
Wang, F.
中科院分区:
工程技术2区
文献类型:
--
作者:
Lu, T. J.;Xu, W.;Wang, F.

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聚合物支撑的金属薄膜作为柔性、大面积电子器件的互连材料,在拉伸时会发生断裂,而断裂应变强烈地依赖于薄膜/基板的界面性质。采用有限元方法和粘聚区模型(CZM)模拟了金属膜和膜/基界面的微观结构,研究了界面性质对金属膜延展性的影响。系统地研究了基片厚度、基片材料的杨氏模数、膜/基片界面刚度、强度和界面断裂能等系统参数对聚合物支撑金属薄膜延展性的影响。结果表明,聚合物支撑金属薄膜的延展性随界面强度的增加而增加,但增加的趋势明显受界面刚度的影响。
Polymer-supported metal films as interconnects for flexible, large area electronics may rupture when they are stretched, and the rupture strain is strongly dependent upon the film/substrate interfacial properties. This paper investigates the influence of interfacial properties on the ductility of polymer-supported metal films by modeling the microstructure of the metal film as well as the film/substrate interface using the method of finite elements and the cohesive zone model (CZM). The influence of various system parameters including substrate thickness, Young’s modulus of substrate material, film/substrate interfacial stiffness, strength and interfacial fracture energy on the ductility of polymer-supported metal films is systematically studied. Obtained results demonstrate that the ductility of polymer-supported metal films increases as the interfacial strength increases, but the increasing trend is affected distinctly by the interfacial stiffness.
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