Net-shape forming of composite packages with high thermal conductivity-猫眼课题宝

高导热复合材料封装的净成型成型

DOI：

10.1007/s11431-008-0346-8

发表时间：

2009-01

期刊：

Science in China Series E-Technological Sciences

影响因子：

通讯作者：

中科院分区：

其他

文献类型：

作者：

Qu XuanHui;Ren ShuBin;Jia ChengChang;He XinBo

微电子和半导体中电子器件的持续小型化推动了具有增强的导热性的新封装材料的开发，以消散电子封装中产生的热量。近年来，人们成功地开发出了SiCp/Al、SiCp/Cu、金刚石/Al和金刚石/Cu等具有高导热性能的复合材料，以取代传统的可伐合金和Cu/W或Cu/Mo合金，应用于高性能电子设备。然而，这些具有高含量增强体的材料由于其较大的硬度和脆性而难以加工成复杂形状的零件，因此在包装领域中没有得到广泛的应用。因此，有必要探索一种适用于这类复合材料的近净成形技术。本文介绍了一种新的粉末注射成形技术--渗透成形，实现了高导热复合材料封装件的近终形制备。

The continuing miniaturization of electronic devices in microelectronics and semiconductors drives the development of new packaging materials with enhanced thermal conductivity to dissipate the heat generated in electronic packages. In recent years, several promising composite materials with high thermal conductivity have been developed successfully for high performance electronic equipment to replace the traditional Kovar and Cu/W or Cu/Mo alloys, such as SiCp/Al, SICp/Cu, diamond/Al and diamond/Cu. However, these materials with high content of reinforcements have not been widely used in packaging field because they are hard to be machined into complex-shaped parts due to their greater hardness and brittleness. So, it is necessary to explore a near-net shape forming technology for these composites. In this paper, a novel technology of powder injection molding-infiltration is introduced to realize the near-net shaped preparation of the composite packages with high thermal conductivity.