Cryogenic auxiliary drilling of printed circuit boards
Cryogenic auxiliary drilling of printed circuit boards
复制标题
印刷电路板低温辅助钻孔
DOI：
10.1108/cw-03-2019-0024
复制
发表时间：
2019-08
期刊：
影响因子：
0.9
通讯作者：
Zheng Lijuan
中科院分区：
文献类型：
--
作者：
Lin Dantian;Wang Chengyong;Fu Lianyu;Ke Yong;He Yuxing;Fang Gexian;Yao Junxiong;Huang Xin;Zheng Lijuan
Purpose
Large capacity current carrier printed circuit board (PCB) imposes strict control requirements on the hole wall roughness. The key factors are chip removal, drilling temperature and tool wear. This paper aims to find out a cryogenic drilling process to control the chip removal, chip morphology, tool wear and finally reduce the hole wall roughness.
Design/methodology/approach
The chip removal process, chip morphology, tool wear and hole wall roughness of glass fiber epoxy resin copper clad laminate (FR-4) drilling were observed and analyzed. The influence of cold air on the chip removal process, chip morphology, tool wear and hole wall roughness was also investigated. An optimization process of cold air auxiliary drilling was proposed to control the hole wall roughness of FR-4.
Findings
The results showed that the discharge time of copper foil chips with obvious characteristics can be used as the evaluation criterion for the smoothness of chip removal. The cold air can promote chip removal and reduce tool wear. In addition, the chip removal and cooling performance will be the best when using −4.7 °C cold air with the injection angle consisted with the angle of helical flute of the drill. The hole wall roughness of FR-4 could be controlled by drilling with −4.7°C cold air.
Originality/value
This paper was the first study of the effect of three kinds of cold air on PCB drilling. This provided a reference for the possibility that the cryogenic drilling methods apply to PCB drilling. A new cold air auxiliary drilling process was developed for large capacity current carrier FR-4 manufacturing.
登录
查看更多内容
DOI：
10.1109/impact.2016.7799994
发表时间：
2016-10
期刊：
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
影响因子：
--
作者：
Xin Huang;Lijuan Zheng;Chengyong Wang;Linfang Wang;Dantian Lin;Bingmiao Liao;Lunqiang Zhang
通讯作者：
Xin Huang;Lijuan Zheng;Chengyong Wang;Linfang Wang;Dantian Lin;Bingmiao Liao;Lunqiang Zhang
影响因子：
0.9
作者：
Hongyan Shi;Qiuxin Yan;Shengzhi Chen
通讯作者：
Hongyan Shi;Qiuxin Yan;Shengzhi Chen
柔性印制电路板微钻孔刀具磨损特性及其对微孔质量的影响
影响因子：
0.9
作者：
Zheng Lijuan;Wang Chengyong;Zhang Xin;Huang Xin;Song Yuexian;Wang Kefeng;Zhang Lunqiang
通讯作者：
Zhang Lunqiang
DOI：
--
发表时间：
2011
期刊：
--
影响因子：
--
作者：
Lü Jian
通讯作者：
Lü Jian
DOI：
--
发表时间：
2011
期刊：
Printed Circuit Information
影响因子：
--
作者：
Lu Wen-w
通讯作者：
Lu Wen-w