Microelectromechanical Engineering Research Program

电气、机械和化学工程系以及材料科学和物理系将参加本次研究活动，以便对微机电器件和系统的性质有一个基本的了解，以便能够开展实验研究。此外，该小组将进行研究，以开发改进的工艺技术，用于制造三维微部件和设计一个示范性的微控制系统。本研究计划分为三个部分：半导体、金属和陶瓷微部件的力学特性，包括静态、动态疲劳和摩擦学性能；发展改进的干蚀刻和多层制造工艺和微系统组装技术的研究；研究和设计一种用于生物医学和神经活动探测的一维位移控制系统或作为大脑显微外科手术的工具。

The Electrical, Mechanical and Chemical Engineering Departments and the Materials Science and Physics Departments will participate in this research activity to gain a fundamental understanding of the properties of microelectromechanical devices and systems so as to be able to carry out experimental research. In addition, this group will conduct research to develop improved process technology for fabrication of three dimensional microcomponents and the design of a demonstrative micro-control system. This research program is organized into three components: o mechanical characterization of micro-components made of semiconductors, metal and ceramics, including static, dynamic fatigue, and tribological properties; o development of improved dry etching and multiple layer fabrication processes and studies of assembly techniques of microsystems and; o study and design of a one dimensional displacement control system for biomedical and applications to probe neural activities or as a tool for microsurgery in the brain.