Indo-U.S. Joint Workshop on Materials Processing, Thin Filmsand Applications, Bangalore, India, December 1988, Award in U.S. and Indian Currencies

描述：该项目支持 12 名美国科学家参与印美合作项目。材料加工、薄膜及应用联合研讨会。 研讨会的目的是确定材料合成、工艺开发和应用领域共同感兴趣的研究领域，并规划两国研究所联合研究项目的大纲。 涵盖的主题包括： 沉积技术，重点是等离子体辅助技术；薄膜和厚膜的材料特性，包括摩擦学、光学、光电和半导体特性；以及候选材料在特定领域的当前技术应用，包括涂层失效机制以及与材料性能的关系。 范围：该研讨会涉及美国和印度非常感兴趣的领域，并且该领域的应用程序正在全球范围内快速开发。 研讨会的主题是当前的，美国 P.I 是该领域研究的领导者。 其他提议的美国与会者都是知名研究人员，他们与印度同行一起应确保会议取得成功。 将生成结果报告。

Description: This project supports participation of 12 U.S. scientists in an Indo-U.S. joint workshop on material processing, thin films and applications. The objectives of the workshop are to identify fields of research of mutual interest in the area of material synthesis, process development and applications, and to plan outlines of joint research projects by institutes in the two countries. Topics to be covered include: Deposition technologies with emphasis on plasma assisted techniques; material properties for thin and thick films including tribological, optical, optoelectrical, and semiconductor properties; and current technological applications of candidate materials in specific fields, including mechanisms of failure of coatings and relation to material properties. Scope: The workshop is in an area of great interest to the U.S. and India and where applications are being developed worldwide at a rapid rate. The topics of the workshop are current, and the U.S. P.I is a leader in research in this field. Other proposed U.S. participants are well established researchers who, along with the Indian counterparts, should ensure a successful outcome of the meeting. A report of the results will be produced.