Micromechanical Deformation

这项研究的目的是开发一种机械测试技术，能够测量微米级体积的机械性能(如屈服强度和断裂韧性)。研究内容包括试验装置的研制以及与试验应用相关的微观变形和断裂机理理论的发展。这种分析能力将显著提高我们分析和从根本上了解新兴技术中材料的结构/性能关系的能力，这些新兴技术包括：薄膜和表面改性材料；微电子；复合材料；界面；以及环境影响，如氢脆。

The objective of this proposed research is to develop a mechanical test technique capable of measuring the mechanical properties (such as yield strength and fracture toughness) of micron-sized volumes. Research includes development of the test device as well as development of micro deformation and fracture mechanism theory related to the application of this test. This analysis capability should markedly improve our capacity to analyze and fundamentally understand structure/property relationships for materials in such emerging technologies as: thin film and surface modified materials; microelectronics; composite materials; interfaces; and environmental effects, such as hydrogen embrittlement.