Research Initiation: Optimal Support Locations for Vibrating Printed Circuit Boards

电子工业正在寻找设计轻量化电子封装的方法，以最大限度地提高其设计结构方面的性能。这项研究的主要目的是为工业界提供必要的工具和技术，以设计轻巧，可靠的电子封装，这些封装可以承受冲击和振动环境。具体而言，将研究如何确定振动印刷电路板的最佳支承位置。许多所需的设计技术目前存在于工业中，然而，迄今为止，它们尚未得到协调和关注这个问题。本研究的主要目标是综合当前最先进的工程技术，从计算力学、数值优化理论和实验方法等领域，制定、建模、模拟和实验评估这个问题的可能解决方案。

The electronics industry is searching for ways to design light weight electronic packages which maximize the performance of the structural aspects of their designs. The primary objective of this research is to provide industry with the necessary tools and techniques to design light weight, reliable electronic packages which are subjected to shock and vibration environments. Specifically, the problem of determining the optimal support locations for vibrating printed circuit boards will be investigated. Many of the required design techniques currently exist in industry, however, they have not to date, been coordinated and focused on this problem. The principal thrust of this research is to synthesize current state-of-the-art engineering technologies from the areas of computational mechanics, numerical optimization theory, and experimental methods, to formulate, model, simulate, and experimentally evaluate possible solutions to this problem.