Research Initiation: Optimal Support Locations for Vibrating Printed Circuit Boards

电子工业正在寻找设计轻质电子封装的方法，使其设计的结构方面的性能最大化。这项研究的主要目标是为工业提供必要的工具和技术，以设计受冲击和振动环境影响的轻质、可靠的电子封装。具体地说，将研究确定振动印刷电路板的最佳支撑位置的问题。目前工业中存在许多必要的设计技术，然而，到目前为止，它们还没有得到协调和关注这个问题。这项研究的主要目的是从计算力学、数值优化理论和实验方法领域综合当前最先进的工程技术，以制定、建模、模拟和实验评估这一问题的可能解决方案。

The electronics industry is searching for ways to design light weight electronic packages which maximize the performance of the structural aspects of their designs. The primary objective of this research is to provide industry with the necessary tools and techniques to design light weight, reliable electronic packages which are subjected to shock and vibration environments. Specifically, the problem of determining the optimal support locations for vibrating printed circuit boards will be investigated. Many of the required design techniques currently exist in industry, however, they have not to date, been coordinated and focused on this problem. The principal thrust of this research is to synthesize current state-of-the-art engineering technologies from the areas of computational mechanics, numerical optimization theory, and experimental methods, to formulate, model, simulate, and experimentally evaluate possible solutions to this problem.