Research Initiation: Optimal Support Locations for Vibrating Printed Circuit Boards

电子工业正在寻找方法 设计重量轻的电子封装， 其设计的结构方面的性能。 的 这项研究的主要目的是为工业界提供 必要的工具和技术，以设计重量轻， 经受冲击的可靠的电子封装， 振动环境 具体而言，确定 印制电路振动最佳支承位置 董事会将进行调查。 许多需要的设计 技术目前存在于工业中，然而，它们不必 目前，我们正在协调和关注这一问题。 的 这项研究的主要目的是综合目前 最先进的工程技术， 计算力学，数值优化理论， 实验方法，制定，建模，模拟， 实验性地评估这个问题的可能解决方案。

The electronics industry is searching for ways to design light weight electronic packages which maximize the performance of the structural aspects of their designs. The primary objective of this research is to provide industry with the necessary tools and techniques to design light weight, reliable electronic packages which are subjected to shock and vibration environments. Specifically, the problem of determining the optimal support locations for vibrating printed circuit boards will be investigated. Many of the required design techniques currently exist in industry, however, they have not to date, been coordinated and focused on this problem. The principal thrust of this research is to synthesize current state-of-the-art engineering technologies from the areas of computational mechanics, numerical optimization theory, and experimental methods, to formulate, model, simulate, and experimentally evaluate possible solutions to this problem.