U.S.-Australia Joint Seminar on Enhanced Thermal Contact Conductance in Microelectronics; Melbourne, Australia; March 1992

该奖项将支持10名美国研究人员参与 一个联合研讨会， 1992年3月在澳大利亚墨尔本举行。 T医生Nejat Veziroglu，清洁能源研究主任 研究所，迈阿密大学，将主持研讨会。 共- 主持人将是约翰·W。谢菲尔德，密苏里州大学- 罗拉和亚瑟威廉姆斯博士，莫纳什大学，克莱顿，维多利亚， 澳大利亚 研讨会在美国-澳大利亚 合作科学计划。 接触热导在许多实际应用中起着重要的作用 热传递是重要操作的应用 因子 在微电子器件、旋转器件、微电子器件和微电子器件中可以找到示例。 机械、低温流体容器、燃料-包壳界面 在核裂变反应堆和飞机结构接头中， 空气动力学加热。 对于冷却微电子器件，大多数 一直在研究如何改善活跃的对流系统， 去除热量，例如冷却射流和通流。 但新 为薄膜应用开发的技术提供了 利用热传导作为 将热量从电子和其他设备中的“热点”转移出去 系统. 美国和澳大利亚的科学家和工程师都是 那些在接触导热方面做重要研究的人。 研讨会的参与者将分享他们的研究成果， 本领域描述了各种新颖的表面制备技术 (such作为接触表面上的金属气相沉积）， 优化表面传热行为，讨论应用， 微电子和其他工业技术领域 重要性，并就今后的合作提出建议 研究活动应该证明是互惠互利的。 一个- 将编写会议记录的卷本报告， 更广泛地传播研讨会上介绍的信息。

This award will support the participation of ten U.S. researchers in a joint seminar on "Enhanced Thermal Contact Conductance in Microelectronics," to be held in Melbourne, Australia, March 1992. Dr. T. Nejat Veziroglu, Director of the Clean Energy Research Institute, University of Miami, will chair the seminar. Co- chairpersons will be Dr. John W. Sheffield, University of Missouri- Rolla, and Dr. Arthur Williams, Monash University, Clayton, Victoria, Australia. The seminar takes place under the U.S.-Australia Cooperative Science Program. Thermal contact conductance plays an important role in many practical applications where heat transfer is a significant operational factor. Examples are to be found in microelectronic devices, rotating machinery, cryogenic fluid containers, the fuel-cladding interface in nuclear fission reactors, and aircraft structural joints subject to aerodynamic heating. For cooling microelectronic devices, most research has been on improving active convective systems for removing heat, such as cooling jets and through-flow. However, new technologies developed for the application of thin films offer opportunities for utilizing thermal conductance as a means of transporting heat away from "hot spots" in electronic and other systems. U.S. and Australian scientists and engineers are among those doing significant research in thermal contact conductance. Participants at this seminar will share their research results in this field, describe various novel surface preparation techniques (such as metallic vapor deposition onto contact surfaces) to optimize surface heat transfer behavior, discuss applications to microelectronics and other technological areas of industrial importance, and make recommendations regarding future cooperative research activities that should prove mutually beneficial. A one- volume report of the proceedings will be prepared that will give broader dissemination of the information presented at the seminar.