Nondestructive Instrumentation for Measuring Thermal Conductivity and Interface Thermal Resistance of Thin Films

在第一阶段开发了一种测量薄膜导热系数的原型，证明了一种测量技术在任何其他现有商业设备无法覆盖的范围内的能力。这种测量方法是基于热阻的定义，而不是过去使用的大多数间接方法。它的操作范围从薄膜光学薄膜扩展到块状材料。该技术通过对厚样品和薄样品的测量得到了验证，其结果与这些材料的公开值密切相关。最终的测试是通过成功地测量在单晶硅衬底上沉积的两个微米厚的二氧化硅薄膜来完成的。在第二阶段期间，该系统的性能将得到显著改善，从而形成一种有用的商业工具。计划对传感头、电子电路和控制软件进行修改。对介质和其他薄膜的导热系数和界面热阻的无损测试的开发和商业应用将使热流特性得到改善的多层结构的设计和建造取得快速进展。该仪器将辅助几项技术，应用于高速电子学、光学、光学和磁光记录、薄膜、超导薄膜以及类金刚石涂层。

A prototype was developed in Phase I for measuring the thermal conductivity of thin films, proving the capabilities of a measuring technique in the range not covered by any other existing commercial equipment. The measurement method is based on the definition of the thermal resistance, as opposed to the mostly indirect methods used in the past. Its operating range extends from thin optical films to bulk materials. The technique was verified by measurements of thin and thick bulk samples and the results closely correlate with the published values for those materials. Final testing was accomplished by successfully measuring two micrometer thick SiO2 films deposited on single crystal silicon substrates. During Phase II the performance of the system will be significantly improved, leading to a useful commercial instrument. Modifications are planned for the sensor head, electronic circuit and control software. Development and commercial availability of a nondestructive test for thermal conductivity and interface thermal resistance in dielectric and other thin films will permit rapid advances to be made in the design and construction of multilayer structures with improved heat flow characteristics. Several technologies will be aided by this instrument, with applications in high speed electronics, optics, optical and magneto-optical recording, thin films, superconducting films, as well as diamond-like coatings.