Nondestructive Instrumentation for Measuring Thermal Conductivity and Interface Thermal Resistance of Thin Films

用于测量薄膜热导率和界面热阻的无损仪器

• 批准号: 9102777
• 负责人: Sergei Govorkov
• 金额: $ 22.5万
• 依托单位: INRAD, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1991
• 资助国家: 美国
• 起止时间: 1991-10-01 至 1994-03-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9102777&HistoricalAwards=false
• 关键词: Nondestructive; Instrumentation; Measuring; Thermal; Conductivity

A prototype was developed in Phase I for measuring the thermal conductivity of thin films, proving the capabilities of a measuring technique in the range not covered by any other existing commercial equipment. The measurement method is based on the definition of the thermal resistance, as opposed to the mostly indirect methods used in the past. Its operating range extends from thin optical films to bulk materials. The technique was verified by measurements of thin and thick bulk samples and the results closely correlate with the published values for those materials. Final testing was accomplished by successfully measuring two micrometer thick SiO2 films deposited on single crystal silicon substrates. During Phase II the performance of the system will be significantly improved, leading to a useful commercial instrument. Modifications are planned for the sensor head, electronic circuit and control software. Development and commercial availability of a nondestructive test for thermal conductivity and interface thermal resistance in dielectric and other thin films will permit rapid advances to be made in the design and construction of multilayer structures with improved heat flow characteristics. Several technologies will be aided by this instrument, with applications in high speed electronics, optics, optical and magneto-optical recording, thin films, superconducting films, as well as diamond-like coatings.

在第一阶段开发了一个原型，用于测量 薄膜的导电性，证明了 测量技术的范围不包括任何其他 现有的商业设备。 测量方法基于 关于热阻的定义，与 大多是过去使用的间接方法。 其操作范围 从薄光学膜延伸到块体材料。 的 通过对薄、厚块体的测量，验证了该技术的有效性 样品和结果与公布的 这些材料的价值。 最终测试由 成功测量两微米厚的SiO2薄膜 在单晶硅衬底上。 在第二阶段， 系统的性能将显著提高， 从而成为一种有用的商业工具。 修改是 为传感器头、电子电路和控制器设计 软件 无损检测技术的发展和商业应用 导热系数和界面热阻 电介质和其他薄膜将允许快速发展， 在多层结构的设计和施工中， 具有改进的热流特性。 几种技术 将有助于这一文书，与应用在高 速度电子学、光学、光学和磁光 记录、薄膜、超导薄膜以及 类金刚石涂层。