Engineering Faculty Internship: Transport Modeling for the Design and Manufacture of Thin Films

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Competitiveness in the manufacture of computers and computer chips depends on many capabilities including the ability to design, analyze and manufacture the uniquely structured thin films that make up electronic devices. Transport phenomenon such as heat and mass transfer and ion diffusion and scattering are critical in the control of chip quality and cost. This research will enhance industry-university collaboration on the modeling and solution methods of transport mechanisms for discretely inhomogeneous, multi-dimensional media (electronic thin-film devices). A unique modeling and analysis approach called discrete element analysis will be developed with the potential to enhance present efforts to integrate geometry, analysis, design and manufacturing to improve engineering efficiency and effectiveness. The important role played by transport processes in manufacturing will be highlighted throughout with active knowledge transfer mechanisms between the university and industrial collaborators.