Engineering Faculty Internship: Computer Interated Statistical Process Control System for Surface Mount Technology (SMT) Circuit Board Production

本项目的目标是为使用表面贴装技术的电子电路板生产线开发一个计算机集成统计过程控制（SPC）系统。该系统将包括一个连接到在线条形码数据采集网络的数据库、一个SPC分析包和一个用于识别和诊断质量问题的专家系统。该项目将探索与工业应用表面贴装技术有关的技术进步，并有可能加强大学与相关工业公司之间的合作。

The objective of this project is to develop a computer- integrated statistical process control (SPC) system for an electronic circuit board production line that uses surface mount technology. The system will consist of a database connected to an on-line bar-code data acquisition network, an SPC analysis package and an expert system for identification and diagnosis of quality problems. The project will explore technological advances related to surface mount technology for industrial applications with the potential for enhancing collaborative efforts between the university and related industrial firms.