Renovation of Materials Processing Laboratory for Electronic Packaging Research

这个奖项将翻新的空间， 材料加工实验室满足 先进电子封装标准 制造和表征设施 电子和光电封装， 材料. 电子封装被认为是 是一个关键领域， 需要研究和研究培训产出， 保持美国在1900年代的实力 以及更远的地方 拟议的设施将是一个 行业的一部分-康奈尔大学 电子封装联盟，一个独特的 康奈尔大学和一个多元化的 包括IBM，数字设备， 碳酸氢钠和AMP。 它的使命是 基础和竞争前直接研究， 在电子领域取得世界领先地位 包装. 电子封装研究. 康奈尔还得到了半导体公司的支持， 研究公司是美国的一个财团。 公司组织赞助研究， 大学提高竞争力 美国支持的研究活动 联盟和SRC目前在五个 关键领域：架构和设计，互连， 材料和薄膜，光电子学，以及 热管理

This Award will renovate the space of a materials processing laboratory to meet with standards of an Advanced Electronic Packaging Facility for the fabrication and characterization of electronic and optoelectronic packages and materials. Electronic packaging is considered to be a critical area where a significant increase in research and research training output is needed to maintain the strength of the U.S. in the 1900's and beyond. The proposed facility will be an integral part of the Industry-Cornell University Alliance for Electronic Packaging, a unique alliance between Cornell University and a diverse set of companies including IBM, Digital Equipment, Carbonundum, and AMP. Its mission is to perform both basic and pre-competitive direct research to achieve world-wide leadership in electronic packaging. Electronic packaging research at Cornell is also supported by the Semiconductor Research Corporation which is a consortium of U.S. companies organized to sponsor research in the universities to enhance the competitiveness of the U.S. The research activities supported by the Alliance and the SRC are currently growing in five key areas: architecture and design, interconnects, materials and thin films, optoelectronics, and thermal management.