Renovation of Materials Processing Laboratory for Electronic Packaging Research

该奖项将翻新材料加工实验室的空间，以达到先进电子封装设施的标准，用于电子和光电封装和材料的制造和表征。电子封装被认为是一个关键领域，需要大幅增加研究和研究培训产出，以保持美国在1900年S时代及以后的实力。拟议中的设施将是工业-康奈尔大学电子包装联盟的组成部分，该联盟是康奈尔大学与包括IBM、Digital Equipment、Carbonunum和AMP在内的各种公司之间的独特联盟。它的使命是进行基础和竞争前的直接研究，以实现电子封装领域的世界领先地位。康奈尔大学的电子封装研究也得到了半导体研究公司的支持，该公司是一个由美国公司组成的财团，旨在赞助大学的研究，以提高美国的竞争力。由联盟和SRC支持的研究活动目前在五个关键领域正在增长：建筑和设计，互连、材料和薄膜、光电子学和热管理。

This Award will renovate the space of a materials processing laboratory to meet with standards of an Advanced Electronic Packaging Facility for the fabrication and characterization of electronic and optoelectronic packages and materials. Electronic packaging is considered to be a critical area where a significant increase in research and research training output is needed to maintain the strength of the U.S. in the 1900's and beyond. The proposed facility will be an integral part of the Industry-Cornell University Alliance for Electronic Packaging, a unique alliance between Cornell University and a diverse set of companies including IBM, Digital Equipment, Carbonundum, and AMP. Its mission is to perform both basic and pre-competitive direct research to achieve world-wide leadership in electronic packaging. Electronic packaging research at Cornell is also supported by the Semiconductor Research Corporation which is a consortium of U.S. companies organized to sponsor research in the universities to enhance the competitiveness of the U.S. The research activities supported by the Alliance and the SRC are currently growing in five key areas: architecture and design, interconnects, materials and thin films, optoelectronics, and thermal management.