Photochemistry and Electrochemistry of Surface-Confined Organometallic Compounds

该奖项在无机，生物无机和有机化学 该计划为研究计划提供持续的支持， Dr. Mark S.马萨诸塞州化学系的赖特顿 理工学院 这项调查涉及到 金属有机化合物光化学和电化学 分子附着在表面上。 将进行四项研究： (1)各种功能附着率和稳定性 基团的金属表面;（2）的光化学 表面限制的有机金属分子;（3）化学 具有氧化还原活性侧基的金属络合物， 用于“调节”金属中心的反应性;和（4） 金属配合物的合成和表征， 可逆的电化学响应，并可连接到 金属表面 在研究（1）中，将特别注意 支付给铂、金和铟/锡氧化物表面， 可用作微电极。 羰基锰化合物， 是光敏的，可以交换多个CO基团， 在研究（2）中使用，一些钌氨合物和 亚铁氰化物络合物。 %%% Wrighton博士将研究有机金属 与金属表面的化合物。 通过改变金属和 在这些复合物中，电子和 可以操纵光化学特性。本研究 与表面化学的许多领域有关，例如 用于能量的电极和微电极的功能化 转换和传感器，或合成，粘附和润湿 的接口。

This award in the Inorganic, Bioinorganic, and Organometallic Program provides continued support for the research program of Dr. Mark S. Wrighton of the Chemistry Department, Massachusetts Institute of Technology. This investigation is concerned with the photochemistry and electrochemistry of organometallic molecules attached to surfaces. Four studies will be pursued: (1) the rate and stability of attachment of various functional groups to metal surfaces; (2) the photochemistry of surface-confined organometallic molecules; (3) the chemistry of metal complexes with redox-active pendant groups that can be used to "tune" the reactivity of the metal center; and (4) synthesis and characterization of metal complexes which show reversible electrochemical response and can be attached to metal surfaces. In study (1), particular attention will be paid to platinum, gold, and indium/tin oxide surfaces which are useful as microelectrodes. Manganese carbonyl compounds which are photosensitive and can exchange multiple CO groups will be used in study (2), as will some ruthenium ammine and ferrocyanide complexes. %%% Dr. Wrighton will investigate the interaction of organometallic compounds with metal surfaces. By varying the metal and the groups attached to it in these complexes, electronic and photochemical characteristics can be manipulated. This research is relevant to many areas of surface chemistry, such as the functionalization of electrodes and microelectrodes for energy conversion and sensors, or the synthesis, adhesion, and wetting of interfaces.