Proposal for a Symposium on Optoelectronic Packaging Science(August 19-21, 1992)

这笔赠款将帮助支持一个关于光子封装的会议/研讨会。这是一年前NSF支持的类似Wrokshop的后续版本。很明显，包装是一个比之前认为的更重要的问题，第一次研讨会只触及了皮毛。今年要讨论的主题领域是：混合多芯片集成和波导互连。

This grant is to help support a conference/workshop on photonic packaging. It is a follow-on to a wrokshop from a similar one supported by NSF one year ago. It was clear that packaging is a much more important subject than previously thought and the first workshop only scratched the surface. This year the topic areas to be discussed are: hybrid multi-chip integration and waveguide interconnects.