Test Data Collection Using Automated Wafer Probers

罗彻斯特理工学院微电子工程系的测试数据收集设施允许他们的半导体工艺工程专业的学生评估他们的设计和加工的质量，管理产量的改进，并从统计的角度彻底分析设备和工艺。学生们在本科期间制造了数千个器件和电路，现在有了半自动晶圆级探测能力，可以在相同的测试时间内收集、分析和关联数量级的测试数据，而之前的测试时间用于手动测试程序。为测试转换而重新连接各种测试仪器的繁琐工作被灵活的矩阵切换系统所取代。只有获得适当的度量标准，才能确定设计和制造过程的质量。密度结构、器件和电路缺陷的自动测试结果将在本实验室和整个微电子课程中得到考虑。

A test data collection facility at the Microelectronic Engineering Department of the Rochester Institute of Technology allows their semiconductor process engineering students to evaluate the quality of their designs and processing, manage yield improvements, and thoroughly analyze devices and processes from a statistical point of view. The students, who fabricate thousands of devices and circuits in their undergraduate years, have now a semi-automatic wafer level probing capability to collect, analyze, and correlate orders of magnitude more test data in the same amount of test time previously devoted to manual test procedures. Tedious re- connections to various test instruments for test changeovers are being replaced by a flexible matrix switching system. The quality of the design and fabrication processes can be determined only if appropriate metrics are obtained. The results of automatic testing for defects in density structures, devices, and circuits are considered in this laboratory and throughout the microelectronics curriculum.