Computer-Aided Engineering (CAE) for the Microelectronic Encapsulation Process

今天，从计算机、消费电子到军事装备，一切都是由微芯片驱动的，微芯片是微电子产业技术链中的第一个环节。为了扩大器件和系统设计的灵活性和容量，微电子封装变得与硅制造一样重要。在现有的封装方式中，占据80%市场份额的塑料封装将继续在微电子产业的增长中发挥主要作用。塑料包装的性能可靠性，在很大程度上取决于密封剂的性能和制造方法。传统上，采用塑料封装的微电子封装的设计和制造是基于经验和直觉的临时方式进行的，这是昂贵和耗时的。这项研究的目的是建立科学基础，并获得表征该过程的工程解决方案。它将利用实验、分析和计算努力开发一种高效、可靠的分析工具。研究结果将提高对过程的理解，并通过计算机模拟手段促进同步工程。

Today, everything from computers, consumer electronics, to military equipment is driven by micro-chips, the first link in the chain of technology for the microelectronic industry. In order to extend the flexibility and capacity of device and system design, microelectronic packaging is becoming as important as silicon fabrication. Among existing encapsulation methods, plastic packaging, which accounts for eighty percent of the market share, will continue to play a major role in the growth of the microelectronic industry. The performance reliability of plastic packaging, greatly depends on the performance of the encapsulants and manufacturing methods. Traditionally, design and manufacturing for microelectronic encapsulation with plastic packaging are conducted in an ad hoc manner based on experience and intuition, which is costly and time consuming. The study is aimed at establishing the scientific basis and attaining an engineering solution for characterizing the process. It will employ experimental, analytical and computational efforts to develop an efficient, reliable analysis tool. The results of the research will improve understanding of the process and facilitate simultaneous engineering by means of computer simulation.