Computer-Aided Engineering (CAE) for the Microelectronic Encapsulation Process

微电子封装过程的计算机辅助工程 (CAE)

• 批准号: 9261719
• 负责人: Lih-Sheng Turng
• 金额: $ 4.97万
• 依托单位: Advanced CAE Technology Inc
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1993
• 资助国家: 美国
• 起止时间: 1993-01-01 至 1993-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9261719&HistoricalAwards=false
• 关键词: Computer; Aided; Engineering; CAE; Microelectronic

Today, everything from computers, consumer electronics, to military equipment is driven by micro-chips, the first link in the chain of technology for the microelectronic industry. In order to extend the flexibility and capacity of device and system design, microelectronic packaging is becoming as important as silicon fabrication. Among existing encapsulation methods, plastic packaging, which accounts for eighty percent of the market share, will continue to play a major role in the growth of the microelectronic industry. The performance reliability of plastic packaging, greatly depends on the performance of the encapsulants and manufacturing methods. Traditionally, design and manufacturing for microelectronic encapsulation with plastic packaging are conducted in an ad hoc manner based on experience and intuition, which is costly and time consuming. The study is aimed at establishing the scientific basis and attaining an engineering solution for characterizing the process. It will employ experimental, analytical and computational efforts to develop an efficient, reliable analysis tool. The results of the research will improve understanding of the process and facilitate simultaneous engineering by means of computer simulation.

今天，从计算机、消费电子产品到 微芯片驱动军事装备， 微电子产业的技术链。 为了 扩展设备和系统设计的灵活性和容量， 微电子封装正变得和硅一样重要 制造。 在现有的封装方法中， 占市场份额80%的包装， 将继续发挥重要作用的增长， 微电子工业 塑料的性能可靠性 包装，在很大程度上取决于性能的澄清剂 和制造方法。 传统上，设计和制造 用于塑料封装的微电子封装 以基于经验和直觉的特别方式进行， 这是昂贵且耗时的。 该研究旨在建立科学基础， 获得用于表征所述过程的工程解决方案。 它将采用实验，分析和计算的努力 开发一种高效可靠的分析工具 的结果 这项研究将提高对这一过程的理解， 利用计算机促进同步工程 仿真