RIA: Experimental Investigation of Convective Single-Phase and Flow Boiling Heat Transfer Augmentation: Applied to the Thermal Control of Electronic Equipment

摘要/ ABSTRACT摘要：本文提出的研究目的是通过结合Tollmien-Schlichting不稳定性的共振激励和气泡播种流动来增强对流单相和流动沸腾传热，并将其应用于电子设备的直接浸入式液体冷却。共振激励是通过在电子元件排下游边缘以上的横流中周期性地插入圆柱体来实现的。同样的钢瓶用于向流体中注入气泡。在(i)无柱面的基本几何形状，（ii）有柱面的增强几何形状和（iii）有柱面的增强几何形状上的传热机理。全息干涉法将用于非定常温度场的可视化和局部传热系数的测量。同时，还将测量总传热系数和压降。

ABSTRACT -- CTS-93-10146 Herman The objective of the proposed research is the experimental investigation of convective single-phase and flow boiling heat transfer enhancement by combined resonant excitation of Tollmien-Schlichting instabilities and seeding the flow with bubbles applied to the direct immersion liquid cooling of electronic equipment. The resonant excitation is achieved by inserting cylinders in cross flow periodically above the downstream edge of electronic component rows. The same cylinders are used to inject bubbles into the flow. The mechanism of heat transfer on (i) the basic geometry without cylinders, (ii) the enhanced geometry with cylinders and (iii) the enhanced geometry with cylinders used for seeding the flow. Holographic interferometry will be used to visualize the unsteady temperature fields and measure local heat transfer coefficients. Also, the overall heat transfer coefficient and pressure drop will be measured.