RIA: Experimental Investigation of Convective Single-Phase and Flow Boiling Heat Transfer Augmentation: Applied to the Thermal Control of Electronic Equipment

摘要-- CTS-93-10146赫尔曼 本研究的目的是通过共振激发Tollmien-Schlichting不稳定性和向流动中添加气泡来强化电子设备直接浸没液体冷却的单相对流和流动沸腾传热。通过在电子元件排的下游边缘上方周期性地插入横流中的圆柱体来实现谐振激励。相同的气缸用于将气泡注入流中。（i）无圆柱体的基本几何形状，（ii）具有圆柱体的增强几何形状和（iii）用于接种流动的具有圆柱体的增强几何形状的传热机制。全息干涉法将被用来显示非稳态温度场和测量局部传热系数。此外，还将测量总传热系数和压降。

ABSTRACT -- CTS-93-10146 Herman The objective of the proposed research is the experimental investigation of convective single-phase and flow boiling heat transfer enhancement by combined resonant excitation of Tollmien-Schlichting instabilities and seeding the flow with bubbles applied to the direct immersion liquid cooling of electronic equipment. The resonant excitation is achieved by inserting cylinders in cross flow periodically above the downstream edge of electronic component rows. The same cylinders are used to inject bubbles into the flow. The mechanism of heat transfer on (i) the basic geometry without cylinders, (ii) the enhanced geometry with cylinders and (iii) the enhanced geometry with cylinders used for seeding the flow. Holographic interferometry will be used to visualize the unsteady temperature fields and measure local heat transfer coefficients. Also, the overall heat transfer coefficient and pressure drop will be measured.