RIA: Experimental Investigation of Convective Single-Phase and Flow Boiling Heat Transfer Augmentation: Applied to the Thermal Control of Electronic Equipment

摘要--CTS-93-10146赫尔曼提出的研究目的是对用于电子设备直接浸没液体冷却的Tollmien-Schlichting不稳定性共振激励和气泡播撒强化单相对流沸腾换热和流动沸腾换热进行实验研究。谐振激励是通过在电子元件排下游边缘上方周期性地在横流中插入圆柱体来实现的。相同的气瓶被用来向气流中注入气泡。(I)无圆柱体的基本几何结构，(Ii)有圆柱体的强化几何结构和(Iii)用于播撒流动的有圆柱体的强化几何结构的换热机理。全息干涉法将用于可视化非稳态温度场和测量局部换热系数。此外，还将测量总的换热系数和压降。

ABSTRACT -- CTS-93-10146 Herman The objective of the proposed research is the experimental investigation of convective single-phase and flow boiling heat transfer enhancement by combined resonant excitation of Tollmien-Schlichting instabilities and seeding the flow with bubbles applied to the direct immersion liquid cooling of electronic equipment. The resonant excitation is achieved by inserting cylinders in cross flow periodically above the downstream edge of electronic component rows. The same cylinders are used to inject bubbles into the flow. The mechanism of heat transfer on (i) the basic geometry without cylinders, (ii) the enhanced geometry with cylinders and (iii) the enhanced geometry with cylinders used for seeding the flow. Holographic interferometry will be used to visualize the unsteady temperature fields and measure local heat transfer coefficients. Also, the overall heat transfer coefficient and pressure drop will be measured.