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Adsorbate Mediated Electrochemical Deposition of Metal Thin Films

Adsorbate Mediated Electrochemical Deposition of Metal Thin Films
吸附质介导的金属薄膜电化学沉积
批准号:
9322657
负责人:
Richard Alkire
金额:
$33.0万
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
1994
资助国家:
美国
项目状态:
已结题
起止时间:
1994-08-15 至 1998-07-31

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中文摘要
翻译
提案审查和分析提案编号:CTS-9322657 p.a.: R.C. Alkire等机构:伊利诺伊大学厄巴纳-香槟分校背景:(提案被审查)界面传输和分离过程(ITSP)计划在先进材料和加工计划(AMPP)中收到并审查了16份提案。所有16个提案都被发送出去进行邮件审查。本提案有以下项目或部门的审稿人建议;ITSP化学反应过程,化学部和固态化学和聚合物。1994年5月4日,一个由5名专家组成的小组在NSF对这16项提案进行了审查。小组成员收到了邮件评论,并将其与他们自己的个人评论一起考虑。他们被要求对提案进行排序,并将其置于以下三组之一:高度推荐推荐(如果资金可用)不推荐(未排序)分析:该提案被置于高度推荐类别(前三名提案)。根据评审人员和小组成员的意见,强烈建议在降低级别的基础上给予资助。以下项目已同意共同资助该提案:ITSP、化学反应过程、固态化学和聚合物。ctes -9322657 Alkire等人,伊利诺伊大学厄巴纳-香槟分校资助计划94财年95财年96财年总计1414 36,667 36,667 110,000 1401 36,667 36,667 110,000 1762 36,666 36,667 36,667 110,000 TOTAL 110,000 110,000 110,000 110,000
英文摘要
PROPOSAL REVIEW AND ANALYSIS Proposal Number: CTS-9322657 P.I.: R.C. Alkire et al Institution: Univ. of Illinois, Urbana-Champaign Context: (within which proposal was reviewed) Sixteen proposals were received and reviewed in the Advanced Materials and Processing Program (AMPP) by the Interfacial Transport and Separation Processes (ITSP) Program. All 16 proposals were sent out for mail review. This proposal had reviewers suggested by the following programs or division; ITSP Chemical Reaction Processes, Chemistry Division and Solid-State Chemistry and Polymers. The 16 proposals were then reviewed by a panel of five experts who met at NSF on May 4, 1994. the panelists were given the mail reviews to consider together with their own individual reviews. They were asked to rank-order the proposals and place them in one of three groups: Highly Recommended Recommended (if funds are available) Not Recommended (not rank-ordered) Analysis: This proposal was placed in the Highly Recommended category (top three proposals). A grant is highly recommended at a reduced level based upon comments from the reviewers and panelists. The following programs have agreed to co-fund this proposal: ITSP, Chemical Reaction Process, and Solid-State Chemistry and Polymers. CTS-9322657 Alkire et al, University of Illinois, Urbana-Champaign Schedule of Funding FY 94 FY 95 FY 96 TOTAL 1414 36,667 36,667 36,666 110,000 1401 36,667 36,666 36,667 110,000 1762 36,666 36,667 36,667 110,000 TOTAL 110,000 110,000 110,000 330,000
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Additive Mediated Nucleation and Growth during Electrodeposition: High-throughput Experiments and Multiscale Simulation
Adsorbate Mediated Electrodeposition: Experimental and Multiscale Numerical Investigations on Surface Roughness and Shape Evolution
Transport Studies on Pitting Corrosion (Materials Research)
Engineering Studies on Electrolytic Cells and Processes: Porous Electrodes, Shape Change, and Optimization
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