RESEARCH INITIATION AWARD: Improved Adhesion and Selective Area Deposition of Metal Films on Ceramics for Microelectronics

研究启动奖：改善微电子陶瓷上金属薄膜的附着力和选择性区域沉积

• 批准号: 9410224
• 负责人: Janet Lumpp
• 金额: $ 10万
• 依托单位: University of Kentucky Research Foundation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1994
• 资助国家: 美国
• 起止时间: 1994-08-01 至 1997-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9410224&HistoricalAwards=false
• 关键词: RESEARCH; INITIATION; AWARD; Improved; Adhesion

9410224 Lumpp Economical manufacturing of high density microelectronic circuits depends on two critical factors: fabrication of fine pitch electrical interconnections and cost reduction by integration of processing steps. Both of these issues are addressed by using ultraviolet light to define circuit patterns. The new procedures utilize ultraviolet excimer lasers to locally decompose AIN and A12O3 surfaces to pattern high resolution metal lines for additive deposition of films without photolithography processing. Laser assisted chemical vapor deposition (CVD) from dimethylaluminum hydride produces a patterned seed layer by direct writing with the laser beam. Thin films are grown by selective area thermal CVD on the decomposed and seeded regions. In practice, adhesion of thick films on AIN has been poor due to nitrogen bubbles formed when the glass phase in the ink oxidizes the substrate. Thick film density is improved by screen printing onto decomposed regions so that the metallized surface is oxidized without blistering the film. Metallized vias are fabricated by laser ablation of the substrate and a detachable metal backing. Electrical properties of films, vias and laser modified surfaces are correlated with chemical analysis results and evaluation of microstructural development. ***

高密度微电子电路的经济制造取决于两个关键因素：细间距电互连的制造和通过集成处理步骤降低成本。 这两个问题都通过使用紫外光来定义电路图案来解决。 新的程序利用紫外准分子激光局部分解AlN和A12O3表面图案化高分辨率的金属线添加剂沉积的薄膜，而无需光刻处理。 激光辅助化学气相沉积（CVD）从二甲基氢化铝产生一个图案化的种子层，通过直接写入的激光束。 薄膜生长的分解和播种区域上的选择性区域热CVD。 在实践中，由于油墨中的玻璃相氧化基材时形成的氮气泡，厚膜在AlN上的粘附性较差。 通过在分解区域上丝网印刷来提高厚膜密度，使得金属化表面被氧化而不会使膜起泡。 金属化过孔是通过激光烧蚀基板和可拆卸的金属背衬来制造的。 薄膜、通孔和激光改性表面的电性能与化学分析结果和微观结构发展的评价相关。 ***