CAREER: Electronic Packaging - Process Development and Microelectronics Education

职业：电子封装 - 工艺开发和微电子教育

• 批准号: 9702108
• 负责人: Janet Lumpp
• 金额: $ 21万
• 依托单位: University of Kentucky Research Foundation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-08-15 至 2001-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9702108&HistoricalAwards=false
• 关键词: CAREER; Electronic; Packaging; Process; Development

Proposal Number: ECS-9702108 Principal Investigator: Janet K. Lumpp The metalization of ceramics is investigated, which is an important problem area in electronics packing. The specific research activities will focus on development of improved adhesion of copper films on aluminum nitride by investigating brazing alloys and copper electroless plating. Aluminum nitride is a very promising high thermal conductivity material and investigation into this area represents the current state of the art. In order to get the heat generated in the conduction lines (almost always copper) from source to sink, good thermal contact (referred to as metallization)) is essential. In the plating process to be developed in this research, an excimer laser is used to define fine pitch interconnect patterns without the need for masks or photoresist patterning. The metallization procedures will be developed with industry collaboration and incorporated into microelectronics courses at the University of Kentucky (UK). The educational plan involves an extremely wide spectrum of participation by local industry, state government, local school systems and multidisciplinary activities within University of Kentucky. Specific elements of the educational plan include: improvement in graduate and undergraduate courses in microelectronics; participation in the Kentucky Electronics Education Project (KEEP) which is aimed at education and retention of middle school and high school students in technical careers; industrial input on the development of the above projects; and an electronic assembly project field trip for young students sponsored by the Center for Manufacturing systems at the University of Kentucky. This was truly an integrated research and education proposal. The goal of the plan is "informed students, prepared teachers, and electronic assembly curriculum materials generated by a partnership between the University of Kentucky College of Engineering, the UK Center for Manufacturing Sy stems, industrial members of the Microelectronics Society (ISHM) and industry sponsors such as Lexan International. University of Kentucky students will gain experience in microelectronics course, electronic packing research and introducing young students to the electronic packaging industry.

建议编号：ECS-9702108主要研究员：珍妮特·K·伦普研究陶瓷的金属化，这是电子封装中的一个重要问题领域。具体的研究活动将集中在通过研究钎焊合金和化学镀铜来提高铜膜在氮化铝上的附着力。氮化铝是一种非常有前途的高导热材料，对这一领域的研究代表了最新的技术水平。为了使传输线(几乎总是铜)产生的热量从源到汇，良好的热接触(称为金属化)是必不可少的。在这项研究中开发的电镀工艺中，使用准分子激光器来定义精细间距的互连图案，而不需要掩模或光刻胶图案。金属化程序将与业界合作开发，并纳入肯塔基大学(英国)的微电子学课程。该教育计划涉及当地行业、州政府、当地学校系统和肯塔基大学内部多学科活动的广泛参与。教育计划的具体内容包括：改进微电子学研究生和本科课程；参加肯塔基州电子教育项目(Keep)，该项目旨在教育和留住初中生和高中生从事技术职业；为上述项目的发展提供工业投入；以及由肯塔基大学制造系统中心赞助的年轻学生电子组装项目实地考察。这确实是一项综合的研究和教育提案。该计划的目标是“由肯塔基大学工程学院、英国系统支架制造中心、微电子学会(ISHM)的工业成员和Lexan International等行业赞助商合作产生的见多识广的学生、准备好的教师和电子组装课程材料。肯塔基大学的学生将获得微电子课程、电子封装研究和向年轻学生介绍电子封装行业的经验。