CAREER: Electronic Packaging - Process Development and Microelectronics Education

主要研究人员：Janet K. Lumpp陶瓷的金属化，这是电子封装中的一个重要问题。具体的研究活动将集中在通过研究钎焊合金和铜化学镀来改善铜膜在氮化铝上的附着力。氮化铝是一种非常有前途的高导热材料，对这一领域的研究代表了当前的技术水平。为了获得从源到槽的传导线上（几乎总是铜）产生的热量，良好的热接触（称为金属化）是必不可少的。在本研究中开发的电镀工艺中，使用准分子激光来定义细间距互连图案，而不需要掩模或光刻胶图案。金属化程序将与工业界合作开发，并纳入肯塔基大学（英国）的微电子课程。该教育计划涉及当地工业、州政府、当地学校系统和肯塔基大学内多学科活动的广泛参与。教育计划的具体内容包括：改进微电子学的研究生和本科生课程；参与肯塔基州电子教育项目（KEEP），该项目旨在教育和留住初中和高中学生从事技术职业；上述项目开发的产业投入；以及肯塔基大学制造系统中心为年轻学生提供的电子组装项目实地考察。这是一个真正的综合研究和教育的建议。该计划的目标是“为学生提供知识，为教师做好准备，并由肯塔基大学工程学院、英国制造系统中心、微电子学会（ISHM）的工业成员和Lexan International等行业赞助商合作编写电子组装课程材料。”肯塔基大学的学生将获得微电子课程、电子封装研究和向年轻学生介绍电子封装行业的经验。

Proposal Number: ECS-9702108 Principal Investigator: Janet K. Lumpp The metalization of ceramics is investigated, which is an important problem area in electronics packing. The specific research activities will focus on development of improved adhesion of copper films on aluminum nitride by investigating brazing alloys and copper electroless plating. Aluminum nitride is a very promising high thermal conductivity material and investigation into this area represents the current state of the art. In order to get the heat generated in the conduction lines (almost always copper) from source to sink, good thermal contact (referred to as metallization)) is essential. In the plating process to be developed in this research, an excimer laser is used to define fine pitch interconnect patterns without the need for masks or photoresist patterning. The metallization procedures will be developed with industry collaboration and incorporated into microelectronics courses at the University of Kentucky (UK). The educational plan involves an extremely wide spectrum of participation by local industry, state government, local school systems and multidisciplinary activities within University of Kentucky. Specific elements of the educational plan include: improvement in graduate and undergraduate courses in microelectronics; participation in the Kentucky Electronics Education Project (KEEP) which is aimed at education and retention of middle school and high school students in technical careers; industrial input on the development of the above projects; and an electronic assembly project field trip for young students sponsored by the Center for Manufacturing systems at the University of Kentucky. This was truly an integrated research and education proposal. The goal of the plan is "informed students, prepared teachers, and electronic assembly curriculum materials generated by a partnership between the University of Kentucky College of Engineering, the UK Center for Manufacturing Sy stems, industrial members of the Microelectronics Society (ISHM) and industry sponsors such as Lexan International. University of Kentucky students will gain experience in microelectronics course, electronic packing research and introducing young students to the electronic packaging industry.