Research Instrumentation for Processing and Characterizationof Electronic Materials and Sensors

9413476 Galipeau拟议的主要研究仪器是用于薄膜材料和需要先进材料和加工技术的设备的制造和表征。 建议的仪器包括：（1）扫描探针显微镜，（2）手动RF蚀刻-蚀刻系统，（3）晶圆旋转器，（4）接触角测角仪，（5）超声波引线键合机，和（6）湿度/温度室。 该仪器被要求增强和扩展南达科他州州立大学微电子与材料实验室（MML）的能力。 MML由超过1500平方英尺的10，000级和100级洁净室空间组成，旨在进行电子材料和设备的制造，加工和表征研究。 该实验室由电气工程学院和工程学院管理。 电气工程系坚定地致力于本科生和研究生的研究培训。 由于现有的MML设施是该部门的主要研究实验室，因此本项目的目标是在该实验室中保持最先进的研究仪器。 这将改善本科和研究生水平的研究培训，为博士学位奠定基础。计划，并提高教师的研究质量。 在MML实验室进行的研究和研究培训主要集中在用于电子设备和包装，传感器的电子材料。和存储设备。 目前的重点是聚酰亚胺和压电/pyro/铁电聚合物/共聚物材料。聚酰亚胺在微电子应用中用作多芯片模块（MCM）和集成电路（IC）中的封装，以及用作保护层或涂层。 特别感兴趣的是使用一种新型的微传感器来研究表面处理，如离子溅射对聚合物中的水渗透的影响。 这种水渗透会影响埃塔尔导电层的粘附和腐蚀，这又会影响器件的可靠性。 所要求的表面探针显微镜将允许表面结构处理的研究。 溅射系统将提供表面改性所需的离子溅射能力，而接触角仪器将提供关于表面能的信息，这对于理解润湿和粘附也很重要。 该项目还将升级和扩大本研究所需的制造设备和测试仪器。 压电/热电/铁电聚合物/共聚物材料用于超声波和热电成像以及铁电非易失性存储器件。 目前感兴趣的是新的先进的铁电共聚物传感器材料的高频介电和机电性能。 如果该项目得到NSF的资助，研究工作将扩展到先进的铁电共聚物材料和传感器加工技术的制造和表征。 这项工作是重要的铁电开关和非易失性计算机存储器的应用。 溅射系统将允许沉积粘附良好的金属测试电极上的薄膜样品和该膜集成压电/热电/铁电传感器的制造。 用扫描探针显微镜和接触角仪研究了这些薄膜的表面拓扑结构和附着力。

9413476 Galipeau The proposed major research instrumentation is for the fabrications and characterization of thin film materials and devices requiring advanced materials and processing techniques. The proposed instrumentation includes: (1) scanning probe microscope, (2) manual RF sputtering-etching system, (3) wafer spinner, (4) contact angle goniometer, (5) ultrasonic wirebonder, and (6) humidity/temperature chamber. This instrumentation is being requested to enhance and expand the capabilities of the Microelectronics and Materials Laboratory (MML) at South Dakota State University. The MML consists of over 1500ft2 of class 10,000 and 100 cleanroom space designed to conduct research on the fabrication, processing, and characterization of electronic materials and devices. The lab is adminstered by the Electrical Engineering Deopartment and the College of Engineering. The Electrical Engineering Department is strongly committed to both undergraduate and graduate research training. Since the existing MML facility is the principle research laboratory of the department, it is the objective of this project to maintain state of the art research instrumentation in this lab. This will improve the research training at both the undergraduate and graduate levels, build a foundation for a Ph.D. program, and improve the research quality of the faculty. The research and research training being conducted in the MML laboratory is focused on electronic materials used for electronic devices and packaging, sensors. and memory devices. Current emphasis is on polyimides and piezo/pyro/ferroelectric polymer/copolymer materials. Polyimides are used in microelectronic applications as dielectrics in multichip modules (MCM)s and integrated circuits (IC)s, and as protective layers or coatings. Of particular interest is using a novel microsensor to study the effects of surface treatments such as ions sputtering on water permeation in the polymer. This water permeation can affect the adhesion and corrosion of m etal conductive layers which in turn can effect device reliability. The requested surface probe microscope would allow for studies of the surface structure treatments. The sputtering system would provide ion sputtering capabilities necessary for surface modification, while the contact angle instrument would provide information on surface energy, also important for understanding wetting and adhesion. This project will also upgrade and expand the fabrication equipment and test apparatus necessary for this research. Piezo/pyro/ferroelectric polymer/copolymer materials are used for ultrasonic and pyroelectric imaging and ferroelectric non-volatile memory devices. Of current interest are the high-frequency dielectric and electromechanical properties of new advanced ferroelectric copolymer sensor materials. If this project is funded by NSF, the research work would be extended to the fabrication and characterization of advanced ferroelectric copolymer materials and sensor processing techniques. This work is important for ferroelectric switching and non-volatile computer memory applications. The sputtering system would permit the deposition of well-adhered metallic test electrodes on thin film samples and the fabrication of this film integrated piezo/pyro/ferroelectric sensors. The surface topology and adhesion of these thin films is best studied with the scanning probe microscope and contact angle instrument.