Development of a Smart Pixel Array Design and Fabrication Facility

智能像素阵列设计和制造设施的开发

• 批准号: 9413804
• 负责人: Kristina Johnson
• 金额: $ 21万
• 依托单位: University of Colorado at Boulder
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1994
• 资助国家: 美国
• 起止时间: 1994-10-01 至 1998-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9413804&HistoricalAwards=false
• 关键词: Development; Smart; Pixel; Array; Design

9413804 Johnson The term "smart pixel" refers to picture elements in a display or photodetector array that may have some or all of the following attributes memory, intra-pixel processing, inter-pixel communication, and optical I/O in the form of photodetectors and modulators or emitters. Smart pixel arrays (SPAs) evolved form passive-addressed spatial light modulators (SLMs) and displays. These devices sport "simple: picture elements consisting of material placed between two overlapping electrodes to modulate the amplitude, phase, or polarization of an optical wave front in response to the potential difference between the two electrodes. SLMs and displays with simple pixels suffer form low frame and refresh rates resulting in image degradation and ghosting, low resolution, and limited pixel functionality. By incorporating active circuitry at each picture element, so-called "smart pixel" arrays overcome many of the problems associated with their predecessors. Industrial interest in the project is high as Kopin Corporation, Boeing, Rockwell Sciences Center, RCA Sarnoff, Boulder Nonlinear Systems, Meadowlark Optics, Physical Optics Corporation , Ford Research Laboratories and Ball Communications are already working with the NSF/ERC for Optoelectronic Computing Systems (OCS) at the University of Colorado at Boulder (CU) to design and fabricate SPAs for applications ranging from micro displays to smart cameras for the intelligent vehicle highway system. These industries have funded, or have committed to fund approximately $322,471 per year in support of personnel and SPA fabrication cost. In addition, Photonics Research Incorporated, science Applications Incorporated and Hughes Aircraft have contracted with the Center for another $290,995 per year to investigate silicon backplanes to drive vertical cavity surface emitting laser for parallel, free-space optical interconnects. There are knowledge-based and technology-based issues that must be addressed to improve the quality and manufact urability of LCOS smart pixel arrays, thus insuring their eventual commercialization. The equipment requested in this proposal will establish the first comprehensive computer-aided design, planarization, and advanced manufacturing and packaging facility for smart pixel array technology. In particular, we propose to purchase with NSF and matching funds computer workstations with color graphics and color printers for a centralized smart pixel design laboratory, wafer polishing and metal deposition systems to planarize the processed die, and develop an automated robotic controlled packaging facility that will lead the way to a low-cost method of manufacturing SPAs. This world class facility will be used for research and research training of undergraduate and graduate students, research associates, faculty, and industrial researchers working in the field of micro display and smart pixel array design. Working SPAs will be cataloged in a library. Documentation will be provided that detail the operating characteristics of the design, including response time, responsivity (when photodetectors are used) and I-V curves where appropriate. One anticipated result of this project is the design of 1024X1180 and 2048X2048 smart pixel arrays for helmet mounted displays. These devices will project 6 bits analog and full color data. High density smart photodetector arrays for enhanced night vision will also be a focus of this research. Another major result anticipated from this project is producing planarized silicon backplanes, resulting in an optically flat surface for the liquid crystal modulator. Finally, an advanced manufacturing and packaging facility will produce a low-cost, robotic-controlled method for manufacturing SPAs.

术语“智能像素”是指显示器或光电探测器阵列中的图像元件，其可能具有以下部分或全部属性：存储器、像素内处理、像素间通信以及光电探测器和调制器或发射器形式的光I/O。智能像素阵列（spa）是由无源寻址空间光调制器（slm）和显示器发展而来的。这些装置的运动“很简单”：由放置在两个重叠电极之间的材料组成的图像元件，以响应两个电极之间的电位差来调制光波前的振幅、相位或偏振。具有简单像素的slm和显示器受到低帧率和刷新率的影响，导致图像退化和重影、低分辨率和有限的像素功能。通过在每个图像元素上集成有源电路，所谓的“智能像素”阵列克服了与它们的前辈相关的许多问题。Kopin公司、波音公司、罗克韦尔科学中心、RCA Sarnoff公司、博尔德非线性系统公司、Meadowlark光学公司、物理光学公司、福特研究实验室和鲍尔通信公司已经与科罗拉多大学博尔德分校（CU）的NSF/ERC光电计算系统（OCS）合作，设计和制造用于从微型显示器到智能车辆高速公路系统的智能摄像头等应用的SPAs。这些行业已经或承诺每年资助大约322,471美元，用于支持人员和SPA制造成本。此外，光子学研究公司、科学应用公司和休斯飞机公司还与该中心签订了每年290,995美元的合同，研究用于平行、自由空间光学互连的驱动垂直腔面发射激光器的硅背板。为了提高LCOS智能像素阵列的质量和可制造性，从而确保其最终的商业化，必须解决基于知识和技术的问题。该提案中要求的设备将为智能像素阵列技术建立第一个全面的计算机辅助设计，平面化和先进的制造和包装设施。特别是，我们建议用NSF和配套资金购买带有彩色图形和彩色打印机的计算机工作站，用于集中的智能像素设计实验室，晶圆抛光和金属沉积系统，以使加工的模具平坦化，并开发自动化机器人控制的包装设施，这将引领低成本制造spa的方法。这个世界级的设施将用于在微显示和智能像素阵列设计领域工作的本科生和研究生、研究助理、教师和工业研究人员的研究和研究培训。工作spa将在图书馆中进行编目。将提供详细说明设计工作特性的文件，包括响应时间、响应率（当使用光电探测器时）和适当的I-V曲线。本项目的预期成果之一是为头盔显示器设计1024X1180和2048X2048智能像素阵列。这些设备将投射6位模拟和全彩色数据。用于增强夜视的高密度智能光电探测器阵列也将是本研究的重点。该项目预计的另一个主要成果是生产平面化硅背板，从而为液晶调制器提供光学平面。最后，先进的制造和包装设备将生产低成本的机器人控制制造spa的方法。