Nanocomposites for Thermal Management

由于各种电子元件的小型化，对更快、更小和更高效的电子设备的需求已经大大增加。因此，计算机芯片和其他微电子元件目前正在经历单位面积封装的器件数量的爆炸性增长。随着这些微电子器件的封装密度(器件数量)从超大规模集成电路(VLSI)发展到超大规模集成电路(ULSI)，这些器件的散热也大幅增加。这就需要研究和开发用于热管理应用的低热膨胀/高导热复合材料。在这项第一阶段的工作中，材料修改公司将开发纳米晶钨(W-铜)复合材料，该复合材料采用双阶段工艺，然后进行快速固结。第一阶段将侧重于合成、固结和性能表征的优化。第二阶段将与两家主要制造商合作，集中于优化工艺-结构-性能参数以及在实验室和实地设备中生产和测试原型(衬底)。已经开始为这一努力与这些制造商中的每一家进行协调。

The need for faster, smaller, and more efficient electronic devices has grown considerably owing to the miniaturization of a variety of electronic components. Hence, computer chips and other microelectronic components are currently undergoing an explosive growth in the number of devices packed per unit area. As the packaging density (number of devices) of these microelectronic devices advances from very large scale integration (VLSI) to ultra-large scale integration (ULSI), the heat dissipated by these devices has also increased substantially. This has necessitated the research and development of low thermal expansion/high thermal conductivity composites for thermal management applications. In this Phase I effort, Materials Modification, Inc. will develop nanocrystalline tungsten-based (W-Cu) composites using a dual stage process followed by rapid consolidation. Phase I will focus on optimization of synthesis, consolidation, and characterization of the properties. Phase II will concentrate on optimization of process-structure-property parameters and the production and testing of prototypes (substrates) in both laboratory and field equipment in conjunction with two major manufacturers. Coordination has already been initiated with each of these manufacturers for this effort.