Sensor Fusion for Advanced Copper Metallization Cluster Tool

用于高级铜金属化集群工具的传感器融合

• 批准号: 9461125
• 负责人: Yong Lee
• 金额: $ 6.5万
• 依托单位: CVC Products Incorporated
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1995
• 资助国家: 美国
• 起止时间: 1995-05-01 至 1996-02-29
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9461125&HistoricalAwards=false
• 关键词: Sensor; Fusion; Advanced; Copper; Metallization

This Small Business Innovation Research Phase I project involves the development of sensor fusion strategy and algorithm for an advanced copper metallization cluster tool for high performance on-chip interconnect. A growing number of low cost in-situ sensors are available to measure the various process parameters in a single wafer rapid thermal processor. In order to meet the increasingly stringent process control requirements for sub-half micron semiconductor technologies, development of the physical sensors as well as the ability to manage and interpret the increasingly larger number of sensor data are needed. The proposed SBIR Phase I project addresses the issue of intelligent integration and interpretation of sensor data. The sensor fusion algorithm will be applied to CVC Products' advanced copper metallization cluster tool which consists of 4 cluster modules (ICP, collimated PVD, MOCVD, RTP/.RTCVD). Sensor fusion technology is a key enabler of the copper metallization technology which is expected to play a strategic role in 0.25um semiconductor technologies and beyond. The sensor fusion algorithm will be developed based on a set of real time and pre/post process sensors that have been developed and verified during the Texas Instruments/ARPA/Air Force MMST program. Additionally, CVC's proprietary sensors as well as commercially available sensors will be used as inputs to the sensor fusion algorithm.

该小型企业创新研究第一阶段项目涉及为用于高性能片上互连的先进铜金属化集群工具开发传感器融合策略和算法。越来越多的低成本原位传感器可用于测量单晶片快速热处理器中的各种工艺参数。为了满足亚半微米半导体技术日益严格的工艺控制要求，需要开发物理传感器以及管理和解释越来越多的传感器数据的能力。拟议的SBIR第一阶段项目解决了传感器数据的智能集成和解释问题。 传感器融合算法将应用于CVC Products的先进铜金属化集群工具，该工具由4个集群模块（ICP、准直PVD、MOCVD、RTP/.RTCVD）组成。传感器融合技术是铜金属化技术的关键推动因素，预计将在0.25 μ m及更高的半导体技术中发挥战略作用。传感器融合算法将基于一组真实的时间和前/后处理传感器开发，这些传感器已在德州仪器/ARPA/空军MMST计划期间开发和验证。此外，CVC的专有传感器以及商用传感器将用作传感器融合算法的输入。