Sensor Fusion for Advanced Copper Metallization Cluster Tool

该小型企业创新研究第一阶段项目涉及开发用于高性能片上互连的先进铜金属化集群工具的传感器融合策略和算法。越来越多的低成本现场传感器可用于测量单个晶片快速热处理机中的各种工艺参数。为了满足亚半微米半导体技术日益严格的工艺控制要求，需要开发物理传感器以及管理和解释越来越多的传感器数据的能力。拟议的SBIR第一阶段项目涉及传感器数据的智能集成和解释问题。该传感器融合算法将应用于CVC Products公司先进的铜金属化丛集工具，该工具由4个簇模块(ICP、准直PVD、MOCVD、RTP/.RTCVD)组成。传感器融合技术是铜金属化技术的关键使能技术，有望在0.25微米及以后的半导体技术中发挥战略作用。传感器融合算法将基于一组实时和前/后处理传感器，这些传感器已经在德州仪器/ARPA/空军MMST计划期间开发和验证。此外，CVC的专有传感器以及商用传感器将被用作传感器融合算法的输入。

This Small Business Innovation Research Phase I project involves the development of sensor fusion strategy and algorithm for an advanced copper metallization cluster tool for high performance on-chip interconnect. A growing number of low cost in-situ sensors are available to measure the various process parameters in a single wafer rapid thermal processor. In order to meet the increasingly stringent process control requirements for sub-half micron semiconductor technologies, development of the physical sensors as well as the ability to manage and interpret the increasingly larger number of sensor data are needed. The proposed SBIR Phase I project addresses the issue of intelligent integration and interpretation of sensor data. The sensor fusion algorithm will be applied to CVC Products' advanced copper metallization cluster tool which consists of 4 cluster modules (ICP, collimated PVD, MOCVD, RTP/.RTCVD). Sensor fusion technology is a key enabler of the copper metallization technology which is expected to play a strategic role in 0.25um semiconductor technologies and beyond. The sensor fusion algorithm will be developed based on a set of real time and pre/post process sensors that have been developed and verified during the Texas Instruments/ARPA/Air Force MMST program. Additionally, CVC's proprietary sensors as well as commercially available sensors will be used as inputs to the sensor fusion algorithm.