Surface Chemistry of Electronic Materials

在这项由化学和材料研究部支持的项目中，Schwartz和Bernasek将研究氧化金属或金属氧化物表面与金属有机络合物衍生覆盖层之间的界面的制备和结构解释。这项研究结合了有机金属化学和表面科学的各个方面。将开发通过引入-OH基团来活化导体或绝缘体表面的方法。将研究金属原子或金属有机络合物与这些表面基团的反应，并与溶液类似物进行对比。将有可能以特定和可重复的方式创建各种类型的混合覆盖层。这些界面层将以共价方式结合在复合材料的各组分之间。研究将在常压和超高真空条件下使用单晶载体在块状氧化物或氮气模拟衬底上并行进行。使用可表征的单晶材料将能够研究覆盖层和载体表面之间的共价相互作用的精确性质和程度。发展表面结合物种的合成方法，并将表面分析技术应用于类似的体相和薄膜载体，将在微观水平上加深我们对材料合成和界面结构的理解。随着电子学和光电子学组件变得更小和更复杂，这些信息形成了理解介观物理和化学界面属性的基础，这些属性变得越来越重要。

In this project supported by the Divisions of Chemistry and Materials Research, Schwartz and Bernasek will study the preparation and structural elucidation of interfaces between oxided metal or metal oxide surfaces and organometallic complex-derived overlayers. This research combines aspects of organometallic chemistry and surface science. Methods will be developed for activation of surfaces of conductors or insulators by introduction of -OH groups. The reaction of metal atoms or organometallic complexes with these surface groups will be studied and contrasted with solution analogs. It will be possible to create various types of mixed overlayers in specific and reproducible ways. These interfacial layers will covalently bond between components of the composite. Investigations will be performed in parallel on bulk oxide or nitrogen analog substrates under ambient and ultra-high vacuum using single crystal supports. The use of characterizable single crystal materials will enable an investigation of the precise nature and extent of covalent interaction between the overlayer and the surface of the support. %%% Development of methodology for synthesis of surface-bound species, and application of surface analytical techniques to analogous bulk and film supports, will augment our understanding of materials synthesis and interface structure at the microscopic level. Such information forms a basis for understanding mesoscopic physical and chemical interfacial properties of increasing importance as electronics and optoelectronics components become smaller and more complex.