Nano-toughening of Conductive Composites with High Electrical Ductility

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This project aims to develop a new technology to effectively toughen conductive thin films including metals and conductive polymers with significantly improved mechanical robustness for next-generation stretchable electronics. This new technique will tackle the major limitation of stretchable electronics propensity to abrupt electrical failure caused by plastic deformation and long channel cracks in conductive thin films of low yield strain and ductility. By overcoming the bottleneck issue of low stretchability and ductility of existing conductive thin film materials, it will be possible to significantly expand the design space of flexible and stretchable electronic devices.