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Research Planning Grant: Integration of the Engineering Function with Production in Semiconductor Manufacturing and Assembly

研究规划资助：半导体制造和组装中工程功能与生产的集成

基本信息

批准号：
9522753
负责人：
Diane Bailey
金额：
$ 1.8万
依托单位：
University of Southern California
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
1995
资助国家：
美国
起止时间：
1995-09-15 至 1996-10-31
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=9522753&HistoricalAwards=false
关键词：
Research Planning Grant Integration Engineering

项目摘要

9522753 Bailey Most research efforts to improve cycle time in semiconductor manufacturing have focused on scheduling issues, and efforts to reduce time to market have used a concurrent engineering approach to approving coordination between engineering and fabrication personnel. This work will plan a research effort toward integrating engineering with the other functions within a firm, from product conception to final assembly. The planning stage is essential because, while the need for thorough engineering integration is well-recognized, the exact description and prioritization of the problems resulting from its absence are not. Collaboration with industry, including visits to semiconductor research, manufacturing, assembly, and packaging facilities, will allow appropriate case studies for the subsequent research to be defined. The sophistication of both semiconductor products and semiconductor manufacturing processes make coordination and integration of semiconductor production systems particularly difficult. The goal of this research is to define clearly the engineering function throughout an organization, to develop a predictive model of firm performance as a function of engineering integration, and then to develop mechanisms for combining the resources of the engineering function with production, assembly, and other departments in this high-technology industry. Both cycle time and time to market could be shortened through a mechanism for engineering integration that allows faster identification and resolution of production problems.

大多数改善半导体制造周期时间的研究工作都集中在调度问题上，减少上市时间的努力使用了并行工程方法来批准工程和制造人员之间的协调。这项工作将计划一项研究工作，以整合工程与公司内的其他职能，从产品概念到最终组装。规划阶段是必不可少的，因为虽然彻底的工程集成的必要性是公认的，但由于缺乏它而产生的问题的准确描述和优先级却没有。与工业界的合作，包括参观半导体研究、制造、组装和包装设施，将为随后的研究确定适当的案例研究。半导体产品和半导体制造工艺的复杂性使得半导体生产系统的协调和集成特别困难。本研究的目标是明确界定整个组织的工程功能，开发一个预测模型的公司业绩作为工程集成的功能，然后开发机制，结合工程功能的资源与生产，装配，和其他部门在这个高科技产业。通过工程集成机制，可以更快地识别和解决生产问题，从而缩短周期时间和上市时间。