SBIR Phase I: Light Element X-Ray Flourescence Using Capillary X-Ray Optics

该小型企业创新研究（SBIR）第一阶段项目将研究使用多毛细管光学器件，使用X射线荧光（XRF）测定硅（Si）半导体衬底上的低原子序数（Z）元素（Z14）。 轻元素污染是半导体生产中的一个重要问题，导致器件产量降低、生产成本增加和工业竞争力受损。 没有令人满意的分析技术，既无损，并有必要的检测限，由半导体工业协会（SIA）的国家技术路线图半导体（NTRMS）。 据预测，多毛细管X射线光学技术可以有效地收集大立体角的X射线，并优先传输低于Si吸收边的光子。 透射光束可以以高强度聚焦在Si半导体的目标区域上。 几个多毛细管纤维的性能特性将被研究用于传输低能X射线在不同的几何配置。 这些结果将被用于设计一种新的多毛细管光学系统的低能XRF和提高信噪比的轻元素分析。 该研究的应用有望将XRF技术的能力扩展到更大范围的轻元素，并将在半导体工业中特别有用。 这些应用将包括材料合成和加工、电子和光子器件制造以及微加工。 半导体器件产量的提高和更有竞争力的分析仪器的预期。

This Small Business Innovation Research (SBIR) Phase I project will investigate the use of polycapillary optics for the determination of low atomic number (Z) elements (Z14) on silicon (Si) semiconductor substrates using X-ray fluorescence (XRF). Light element contamination is a significant problem in semiconductor production resulting in reduced device yields, increased production costs, and impaired industrial competitiveness. No satisfactory analytical technique is available that is both nondestructive and has the necessary detection limits as set by the Semiconductor Industry Association (SIA) National Technology Road Map for Semiconductors (NTRMS). It is predicted that the technology of polycapillary X-ray optics can effectively collect a large solid angle of X-rays and preferentially transmit photons below the Si absorption edge. The transmitted beam can be focused upon the targeted area of a Si semiconductor with high intensity. The performance characteristics of several polycapillary fibers will be studied for transmission of low energy X-rays in different geometric configurations. These results will be used to design a novel polycapillary optical system for low energy XRF and improve the signal-to-noise ratio for light element analysis. Applications of the research are expected to extend the capability of the XRF technique to a greater range of light elements and will be particularly useful in the semiconductor industry. These applications will include materials synthesis and processing, electronic and photonic device fabrication, and microfabrication. Improved semiconductor device yields and more competitive analytical instrumentation are expected.