SBIR Phase I: High Temperature Shape Memory Alloy Thin Film for Micro-Electro-Mechanical Systems (MEMS)

该小型企业创新研究第一阶段项目将开发用于微机电（MEM）系统的真空沉积高温SMA薄膜技术。这些薄膜的物理和机械特性与传统形式的TiNi相同，甚至更好。也许最重要的是，薄膜沉积工艺与Si微机械加工工艺兼容，并为使用SMA致动器大规模生产高度集成的微器件提供了独特的可能性。 第一阶段的研究工作将利用溅射技术的优势来获得高温SMA致动器。将生产具有广泛厚度（1至20微米）和成分的箔，用于测试目的，并用作由Ti-Ni合金公司设计的流体和气体微型阀的致动器。 可靠和快速作用的闭锁/释放机构，微型可复位断路器，安全装置，带和膜阀致动器只是这种材料的一些潜在用途。

This Small Business Innovation Research Phase I project will develop a technology for vacuum deposited high temperature SMA thin film for micro-electro-mechanical (MEM) systems. These films exhibit physical and mechanical characteristics identical and even better than those of conventional forms of TiNi. Perhaps most importantly, the process of thin film deposition is compatible with that for Si micromachining and offers a unique possibility for the mass production of highly integrated microdevices using SMA actuators. This Phase I research effort will take advantage of the benefits of sputtering technique to obtain high temperature SMA actuators. Foils with a wide range of thickness (I to 20 microns) and composition will be produced for testing purposes and for use as actuators for fluid and gas microvalves designed by Ti-Ni Alloy Company. Reliable and fast acting latching/release mechanisms, miniature resetable circuit breakers, safety devices, strip and membrane valve actuators are just some of potential uses for this material.