GOALI/IUCP: A Flow Simulation and Mold Design for Plastic Encapsulation of Microchips

小行星9622246 在半导体制造中，适当的封装对于高组装产量和芯片的长期可靠性至关重要。 然而，如果模具几何形状、封装材料和处理条件没有被适当地选择，则塑料的传递模塑期间的流动可能产生微芯片/引线框组件的间隙移动以及使连接线变形。 目前，模具设计是基于试错法。 GOALI的这一合作项目将开发一种用于封装过程流动模拟的软件工具，以便模具设计师能够预测成型器件中的缺陷，并相应地修改成型工艺，以减少生产过程中的装配缺陷。 这项工作可能会提供一个组合的流体流动/固化模型，这是可扩展到封装过程以外的其他应用程序的发展显着的进步。

9622246 Gupta A proper encapsulation is essential for high-assembly yields and a long-term reliability of the chip in the semiconductor manufacturing. However, if the mold-geometry, encapsulating material and the processing conditions are not selected properly, the flow during the transfer molding of plastic may produce a gapwise movement of the microchip/leadframe assembly as well as deform the connecting wires. Currently, the mold design is based upon trial-and-error approach. This collaborative GOALI award will develop a software tool for flow simulation of the encapsulation process so that the mold designer will be able to predict the defects in the molded device and modify the molding process accordingly to reduce the assembly defects during production. This work is likely to provide significant advancement in the development of a combined fluid-flow/curing model which is expandable to other applications outside of the encapsulation processes.