GOALI/IUCP: Testing and Constitutive Modeling of Joining Materials for Design and Reliability in Electronic Packaging

9812696德赛这一学术联系机会(GOALI)研究项目是电子封装创新模型和测试设备工作的继续。在实验室测试、本构模型和计算机分析的集成方面，将采取几个新的方向。开发了一种新的热机械激光干涉测量装置，并将进行一系列试验，以获得循环机械和热载荷变化对连接材料(包括无铅材料)的影响。材料的这种热力学行为将被纳入使用扰动状态概念(DSC)的统一本构建模方法中。初步工作证明了该模型在各种焊料和硅上的简单应用的有效性。这项研究项目将集中于描述建模和测试的集成，以实现未来设计和可靠性分析方法的优化。该项目解决了更好地了解电子封装的可靠性及其对微电子行业的影响的重要需求。

9812696 Desai This Grant Opportunities for Academic Liaison with Industry (GOALI) research project is the continuation of work on an innovative model and test device for electronic packaging. Several new directions will be undertaken in the integration of laboratory testing, constitutive modeling and computer analysis. A new thermomechanical laser interferometry device has been developed and a series of tests will be performed to gain information on the effects on joining materials, including lead-free materials, of variations in cyclic mechanical and thermal loading. This thermomechanical behavior of the material will be incorporated into the unified constitutive modeling approach using the disturbed state concept (DSC). The preliminary work has demonstrated the validity of the model for simple applications on various solders and silicon. This research project will focus upon characterizing the integration of the modeling and testing to permit future optimization of design and reliability analysis methodology. This project addresses the significant need of having a better understanding of reliability in electronic packaging and the impact upon the microelectronics industry.