Electronic Packaging and Materials

EEC-9700705摘要该奖项在米诺鲁塔亚博士的指导下，向华盛顿大学提供资金，以支持一个名为“电子包装和材料”的研究-课程开发项目。这个项目的目标是在华盛顿大学建立一个关于电子封装和材料(EPM)的跨学科研究课程。作为现有的电视工程教学系统的一部分，我们将为高级本科生和一年级研究生以及来自本地和地区工业的工程师设计一个包含四个课程的课程，并辅之以新的研究成果。

EEC-9700705 ABSTRACT This award provides funding to the University of Washington, under the direction of Dr. Minoru Taya, for the support of a Combined Research-Curriculum Development project entitled, "Electronic Packaging and Materials." This project's goals are to establish an interdisciplinary research-curriculum on electronic packaging and materials (EPM) at the University of Washington. A curriculum of four courses with materials supplemented by new research results will be designed for teaching advanced undergraduate and first-year graduate students as well as engineers from local and regional industries as a part of the existing Televised Instruction in Engineering (TIE) system.