Electronic Packaging and Materials

电子封装及材料

• 批准号: 9700705
• 负责人: Minoru Taya
• 金额: $ 42.08万
• 依托单位: University of Washington
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-07-15 至 2001-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9700705&HistoricalAwards=false
• 关键词: Electronic; Packaging; Materials

EEC-9700705 ABSTRACT This award provides funding to the University of Washington, under the direction of Dr. Minoru Taya, for the support of a Combined Research-Curriculum Development project entitled, "Electronic Packaging and Materials." This project's goals are to establish an interdisciplinary research-curriculum on electronic packaging and materials (EPM) at the University of Washington. A curriculum of four courses with materials supplemented by new research results will be designed for teaching advanced undergraduate and first-year graduate students as well as engineers from local and regional industries as a part of the existing Televised Instruction in Engineering (TIE) system.

EEC-9700705 摘要 该奖项为华盛顿大学提供资金，在Minoru Taya博士的指导下，支持一个名为“电子封装与材料”的综合研究课程开发项目。“这个项目的目标是在华盛顿大学建立一个关于电子封装和材料的跨学科研究课程。 将设计四门课程的课程，并辅以新的研究成果，用于教授高级本科生和一年级研究生以及来自当地和区域行业的工程师，作为现有工程电视教学（TIE）系统的一部分。