US-India Cooperative Research: Evaluation and Characterization of Composite Materials Under Dynamic Loading Conditions, Award in Indian Currency

9714914 Agarwal描述：该奖项是为美国和印度的研究合作 “动态载荷条件下复合材料的评价和表征”。 共同研究者是罗得岛大学的Shukla教授和B.D. Agarwal，印度理工学院（IIT），坎普尔。 PI将利用根据早些时候的特别外汇赠款建立的实验设施进行研究，该赠款支持在坎普尔的IIT发展动态应力和断裂分析实验室。 该设备现已准备就绪，并正在用于动态光弹性实验。 研究的重点是进一步发展透明复合材料的制造，并对纤维增强复合材料的动态断裂和损伤扩展进行新的研究。 实验技术将利用动态摄影和断口分析的原理。 适用范围：该合同将允许PI继续使用现已完成的坎普尔实验设施在动态载荷条件下表征复合材料的有趣工作。 PI开发了一种独特的技术来确定复合材料的内部应变状态。 这些材料的应用越来越多，其中许多将涉及动态加载。 该研究将为复合材料提供新的基础信息。 研究成果是相互的，研究成果将被公布。 ***

9714914 Agarwal Description: This award is for the US-India research collaboration "Evaluation and Characterization of Composite Materials under Dynamic Loading Conditions". The co-investigators are Professors Shukla of the University of Rhode Island and B.D. Agarwal, Indian Institute of Technology (IIT), Kanpur. The PIs will carry out research utilizing the experimental facilities established under an earlier Special Foreign Currency grant that supported the development of a dynamic stress and fracture analysis laboratory at IIT, Kanpur. The facility is now ready and is being used for dynamic photoelastic experiments. The focus of the research is to further developments in the fabrication of transparent composites and to conduct new investigations on the dynamic fracture and damage growth in fiber reinforced composite materials. The experimental technique will utilize the principles of dynamic photography and fractography. Scope: This award will allow the PIs to continue the interesting work begun on the characterization of composite materials under dynamic loading conditions using the now completed experimental facility at Kanpur. The PIs have developed a unique technique for determining the internal strain state of composite materials. These materials are finding increasing application, many of which will involve dynamic loading. The research will provide new fundamental information about composite materials. The benefits are mutual and the research results will be published. ***