SBIR Phase I: Acoustic Microcavitation Assisted Fine Cleaning of Post-Chemical Mechanical Planarizing (CMP) Wafers

* 9761140麦肯纳 这个小企业创新研究第一阶段项目提出了一种新的技术，用于清洁半导体晶片使用声诱导微空化（ACIM）。 该技术依赖于精确控制颗粒位置处的声微空化的强度和位置，以将颗粒从晶片表面去除。它将有效地去除甚至亚微米颗粒而不损坏晶片衬底。ACIM是一种在去离子水环境中操作的无化学品、环境友好的工艺。第一阶段的目标是确定使用ACIM进行精细清洁的可行性。 通过详细的实验，我们将评估ACIM辅助精细清洗后CMP（化学机械抛光）晶片的性能。 实验将研究可行性，并为第二阶段的原型设计提供信息。 ACIM辅助清洗将解决在不损坏精密表面的情况下进行清洗的需求，特别是半导体制造中的硅片。 这是一种不含化学物质、环境友好的技术，与当今可用的其他方法不同，它可以确保超清洁度、精度和速度。 ACIM非常经济有效，并且易于在现有基础设施中实现。 ***

*** 9761140 McKenna This Small Business Innovation Research Phase I project proposes a novel technique for cleaning of semiconductor wafers using Acoustic Coaxing Induced Microcavitation(ACIM). This technique relies on precisely controlling the intensity and location of acoustic microcavitation at a particulate site to dislodge that particulate from the wafer surface. It will be effective for removing even sub-micron particles without damaging the wafer substrate. ACIM is a chemical-free, environmentally friendly process operating in a de-ionized water environment. The objective of Phase I is to establish the feasibility of using ACIM for fine cleaning. Through detailed experiments we will assess the performance of ACIM assisted fine cleaning of post-CMP(chemical mechanical polishing) wafers. The experiments will study the feasibility and provide information for prototype design during Phase II. ACIM assisted cleaning will solve the need for cleaning without damage of precision surfaces, specifically the silicon wafers in semiconductor manufacturing. It is a chemical free, environmentally friendly technique for ensuring ultra-cleanliness with precision and speed unlike other methods available today. ACIM is very cost effective, and easy to implement in the existing infrastructure. ***