Fast 3-D Analysis and Macromodel Generation of Interconnect, Packaging and MEMs Using Green's Function Independent Accelerated Iterative Methods

点击翻译按钮获取中文摘要

Recent developments in fast integral equations solvers combined withmodel-order reduction techniques has made it possible to automaticallygenerate reduced-order models directly from 3-D simulation of complicatedinterconnect. This research is on extending the approach to higherfrequency analysis of interconnect, and to multiple-domain applicationssuch as micromachined devices. The topics that will be investigatedinclude: well-conditioned purely surface formulations for wide frequencyrange full-wave analysis of interconnect, Greens function independent fastsolvers for integral formulations, and approaches to model-order reductionbased on drawing a connection between the optimal Hankel norm reductionmethods used in control theory and the Krylov-subspace methods used ininterconnect analysis. This combination of formulation, fast solver, androbust model-order reduction makes it possible to automatically generatemacromodels for system-level simulation of a broad set of technology.