Fast 3-D Analysis and Macromodel Generation of Interconnect, Packaging and MEMs Using Green's Function Independent Accelerated Iterative Methods

结合模型降阶技术的快速积分方程求解器的最新发展，使得从复杂互连的三维模拟中直接自动生成降阶模型成为可能。本研究旨在将该方法扩展到互连的高频分析，以及多领域应用，如微机械设备。将研究的主题包括：用于互连宽频率范围全波分析的条件良好的纯表面公式，积分公式的格林函数独立快速求解器，以及基于在控制理论中使用的最优Hankel范数约简方法与互连分析中使用的krylov子空间方法之间建立连接的模型阶约简方法。这种组合的公式，快速求解器，和鲁棒模型的顺序减少，使它能够自动生成宏观模型的系统级仿真的广泛的技术集。

Recent developments in fast integral equations solvers combined withmodel-order reduction techniques has made it possible to automaticallygenerate reduced-order models directly from 3-D simulation of complicatedinterconnect. This research is on extending the approach to higherfrequency analysis of interconnect, and to multiple-domain applicationssuch as micromachined devices. The topics that will be investigatedinclude: well-conditioned purely surface formulations for wide frequencyrange full-wave analysis of interconnect, Greens function independent fastsolvers for integral formulations, and approaches to model-order reductionbased on drawing a connection between the optimal Hankel norm reductionmethods used in control theory and the Krylov-subspace methods used ininterconnect analysis. This combination of formulation, fast solver, androbust model-order reduction makes it possible to automatically generatemacromodels for system-level simulation of a broad set of technology.