The Flow of Dense Suspensions in Manufacturing Processes

制造过程中浓悬浮液的流动

• 批准号: 9908332
• 负责人: Gary Lehmann
• 金额: $ 29.16万
• 依托单位: SUNY at Binghamton
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1999
• 资助国家: 美国
• 起止时间: 1999-09-01 至 2003-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9908332&HistoricalAwards=false
• 关键词: Flow; Dense; Suspensions; Manufacturing; Processes

The objective of this research is to improve the fundamental understanding of a capillary flow process, that is a key step in the manufacture of electronic systems, and the effective delivery of these process fundamentals through the development of software based flow process tool. The flow process arises in the manufacture of direct-chip-attachment packaged electronics. Here a solder bump array provides the I/O interconnection between a chip and substrate. The process goal is to rapidly flow an "underfill" material, which is a mixture of silica particles suspended in an epoxy, into the passage formed by the chip, substrate and solder bump surfaces. A laboratory study on the capillary flow of dense suspensions in small flow passages will be conducted. Motion of the mixture-air interface will be tracked and correlated with a number of parameters including the chip-to-substrate standoff (10~100 microns); the mixture rheology; the wetting surfaces (both chemical inhomogeneity and patterned surface topology are typical of the electronics application); and, solder bump geometric pattern. Rheological measurements will be conducted for both commercial underfill materials and model suspensions. Flow modeling will be conducted at two distinct levels: (1) to understand the underlying mechanisms; and, (2) to develop cost-effective calculation strategies for implementation in the flow process tool.

这项研究的目的是提高对毛细流动过程的基本理解，这是电子系统制造中的关键步骤，并通过开发基于软件的流动处理工具来有效地交付这些过程基本原理。该流程出现在直接贴片封装电子产品的制造过程中。这里，焊料凸起阵列提供芯片和衬底之间的I/O互连。该工艺的目标是将一种“欠填充”材料，即悬浮在环氧体中的二氧化硅颗粒的混合物，快速流动到由芯片、基板和焊料凸起表面形成的通道中。将对小流道中稠密悬浮液的毛细流动进行实验室研究。混合空气界面的运动将被跟踪，并与许多参数相关联，包括芯片与基板的距离(10~100微米)；混合物的流变性；润湿表面(化学不均匀和图案化表面拓扑都是典型的电子应用)；以及焊料凸起几何图案。将对商业底填材料和模型悬浮液进行流变学测量。流程建模将在两个不同的层面上进行：(1)了解基本机制；(2)开发成本效益计算策略，以便在流程处理工具中实施。