STTR Phase I: Integral Resistors for High Peformance Applications

该小型企业技术转移(STTR)项目将开发用于高性能应用的集成电阻器。阿肯色州微电子开发公司(AMDC)和阿肯色大学。采用一种新的制备技术，包括非晶硅沉积、铝辅助晶化和低温掺杂，以获得从1-10欧姆-厘米的范围内的电阻，这是高性能应用中的一个重要范围。由于这种多晶硅沉积工艺是在阿肯色大学的光伏中心开发的，阿肯色大学将作为研究机构。这一正在申请专利的沉积工艺将允许AMDC和美国阿肯色州设计和制造0.1-0.5 mW的集成电阻，这反过来将导致更小、更可靠的电子封装以更高的整体基板效率运行。采用集成无源元件的电子基板不仅可以减少尺寸、重量、功率和成本，而且还可以提高电气性能。第二阶段将把集成电阻与AMDC经过验证的集成电容器结合在一起。加利福尼亚州圣地亚哥的Space Electronics Inc(SEI)将作为分包商参加，以提供适用于当前市场的产品演示。阿肯色州科学和技术局(ASTA)也将寻求匹配资金。潜在的商业应用在无线行业(寻呼机和手机)，产品小型化和减轻重量是必不可少的。

This Small Business Technology Transfer (STTR) project will develop integral resistors for high performance applications. Arkansas Microelectronics Development Corporation (AMDC) and the University of Arkansas . A novel fabrication technique involving amorphous silicon deposition followed by aluminum assisted crystallization and doping at low temperature will be used in order to achieve resistances ranging from 1 - 10 ohm-cm, an important range in high performance applications. Since this poly-microsilicon deposition process was developed at the University of Arkansas'Photovoltaics Center, the University of Arkansas (U of A) will act as the research institution. This patent pending deposition process will allow AMDC and the U of A to design and fabricate 0.1- 0.5 MW integral resistors which will, in turn, result in smaller, more reliable electronic packaging operating with greater overall substrate efficiency. Electrical substrates with integral passive components will not only provide a reduction in size, weight, power, and cost, but they will also improve electrical performance. Phase II will incorporate integral resistors with AMDC's proven integral capacitors. Space Electronics Inc (SEi), of San Diego, CA, will participate as a subcontractor in order to provide product demonstrations applicable to the current market. Matching funds from the Arkansas Science and Technology Authority (ASTA) will also be pursued.Potential commercial applications are in the wireless industries (pagers and cell phones) where product miniaturization and weight reduction are essential.