STTR Phase I: Integral Resistors for High Peformance Applications

该小型企业技术转让（STTR）项目将开发用于高性能应用的集成电阻器。阿肯色州微电子开发公司（AMDC）和阿肯色州大学。一种新的制造技术，涉及非晶硅沉积，然后在低温下铝辅助结晶和掺杂，将用于实现电阻范围从1 - 10欧姆-厘米，在高性能应用中的一个重要范围。由于这种多晶硅沉积工艺是在阿肯色州大学的光化学中心开发的，因此阿肯色州大学（A大学）将担任研究机构。这种正在申请专利的沉积工艺将允许AMDC和U of A设计和制造0.1- 0.5 MW的集成电阻器，这反过来又会导致更小，更可靠的电子封装，并以更高的整体基板效率运行。具有集成无源元件的电气基板不仅可以减小尺寸、重量、功率和成本，而且还可以提高电气性能。第二阶段将整合电阻与AMDC的证明积分电容器。加利福尼亚州圣地亚哥的Space Electronics Inc（SEi）将作为分包商参与，以提供适用于当前市场的产品演示。还将寻求阿肯色州科学技术管理局（ASTA）的配套资金。潜在的商业应用是在产品小型化和减轻重量至关重要的无线工业（寻呼机和蜂窝电话）中。

This Small Business Technology Transfer (STTR) project will develop integral resistors for high performance applications. Arkansas Microelectronics Development Corporation (AMDC) and the University of Arkansas . A novel fabrication technique involving amorphous silicon deposition followed by aluminum assisted crystallization and doping at low temperature will be used in order to achieve resistances ranging from 1 - 10 ohm-cm, an important range in high performance applications. Since this poly-microsilicon deposition process was developed at the University of Arkansas'Photovoltaics Center, the University of Arkansas (U of A) will act as the research institution. This patent pending deposition process will allow AMDC and the U of A to design and fabricate 0.1- 0.5 MW integral resistors which will, in turn, result in smaller, more reliable electronic packaging operating with greater overall substrate efficiency. Electrical substrates with integral passive components will not only provide a reduction in size, weight, power, and cost, but they will also improve electrical performance. Phase II will incorporate integral resistors with AMDC's proven integral capacitors. Space Electronics Inc (SEi), of San Diego, CA, will participate as a subcontractor in order to provide product demonstrations applicable to the current market. Matching funds from the Arkansas Science and Technology Authority (ASTA) will also be pursued.Potential commercial applications are in the wireless industries (pagers and cell phones) where product miniaturization and weight reduction are essential.