SBIR Phase I: Novel Joining Method for Self-Assembly of Reliable Three Dimensional Micro-Electro-Mechanical Systems

SBIR 第一阶段：可靠三维微机电系统自组装的新型连接方法

• 批准号: 9960998
• 负责人: Brian Schaible
• 金额: $ 9.91万
• 依托单位: SPORIAN MICROSYSTEMS, INC.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-01-01 至 2000-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9960998&HistoricalAwards=false
• 关键词: SBIR; Phase; Novel; Joining; Method

This project will explore a unique and ingenious use of solder to 'self-assemble' two-dimensional surface micromachined Micro-Electro-Mechanical Systems (MEMS) structures into useful three-dimensional structures. With this combined joining and assembly approach, surface tension forces in molten solder serve to assemble 3D MEMS structures. A number of promising commercial applications have been identified. Most promising of these applications involves MEMS corner cube reflectors for communication and identification. Current work on MEMS solder self-assembly has yet to provide the level of understanding needed to fully define the capabilities and limitations of the process. Further studies of the fundamental issues are needed to understand these capabilities and limitations so that the process can be made commercially viable. Key research personnel from industry and education and state-of-the-art equipment are in place. This project will develop the solder self-assembly process and contribute to engineering knowledge by answering the following questions: What are the performance limits of MEMS solder self-assembly? What are the commercial applications within these limits?

这个项目将探索一个独特的和巧妙的使用焊料“自组装”的二维表面微加工微机电系统（MEMS）结构成有用的三维结构。 通过这种结合的连接和组装方法，熔融焊料中的表面张力用于组装3D MEMS结构。 已经确定了一些有前途的商业应用。这些应用中最有前途的是用于通信和识别的MEMS角隅棱镜反射器。 目前关于MEMS焊料自组装的工作还没有提供充分定义该过程的能力和限制所需的理解水平。 需要对基本问题进行进一步研究，以了解这些能力和局限性，从而使该过程在商业上可行。 来自工业和教育的主要研究人员和最先进的设备已经到位。这个项目将开发焊料自组装过程，并通过回答以下问题来帮助工程知识：MEMS焊料自组装的性能限制是什么？在这些限制范围内的商业应用是什么？