SBIR Phase II: Novel Joining Method for Self-Assembly of Reliable Three Dimensional Micro-Electro-Mechanical Systems

SBIR第二阶段：可靠三维微机电系统自组装的新型连接方法

• 批准号: 0091582
• 负责人: Brian Schaible
• 金额: $ 49.99万
• 依托单位: SPORIAN MICROSYSTEMS, INC.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2001
• 资助国家: 美国
• 起止时间: 2001-06-01 至 2003-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0091582&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Novel; Joining

This Small Business Innovation Research (SBIR) Phase II project will continue to develop a solder self-assembly process that was the concept explored in Phase I. It will build upon the successful Phase I results that demonstrated the use of solder to self-assemble two-dimensional surface micromachined Micro-Electro-Mechanical Systems (MEMS) into useful three-dimensional structures. This concept is a next step in the evolution of MEMS assembly. The overall objective of Phase II is to move the technology from the lab environment to a commercial production process that is well understood and has excellent yield. Research personnel from industry and education are involved and state-of-the-art equipment will be utilized.A number of promising commercial applications have been identified and discussions with potential commercial partners suggest interest in commercializing this technology.

这个小型企业创新研究（SBIR）第二阶段项目将继续开发焊料自组装工艺，这是第一阶段探索的概念。它将建立在成功的第一阶段的结果，证明了使用焊料自组装二维表面微加工微机电系统（MEMS）到有用的三维结构。这一概念是MEMS组件发展的下一步。第二阶段的总体目标是将该技术从实验室环境转移到商业生产过程中，该过程已被充分理解并具有出色的产量。来自工业界和教育界的研究人员将参与其中，并将使用最先进的设备。已经确定了一些有前途的商业应用，并与潜在的商业伙伴进行了讨论，表明有兴趣将这项技术商业化。