Stress Networks in Weakly Connected Matter

弱连通物质中的应力网络

• 批准号: 9975533
• 负责人: Thomas Witten
• 金额: $ 31.2万
• 依托单位: University of Chicago
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1999
• 资助国家: 美国
• 起止时间: 1999-07-01 至 2002-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9975533&HistoricalAwards=false
• 关键词: Stress; Networks; Weakly; Connected; Matter

9975533WittenThis award supports theoretical research on the crumpling of materials. The PI seeks to extend previous work that found a simple mathematical description of the individual ridges that make up a crumpled sheet. Further work is aimed at finding mathematical relations that determine when and how the ridges will buckle. The crumpling of materials down to smaller and smaller volumes will be investigated with the aim of finding characteristic features of the process that are universal. The PI will also investigate the packing of granular materials (e.g. sandpiles). Using numerical simulations of perfectly hard, small frictionless spheres, the PI will study the microscopic motion of the grains that occurs in response to small disturbances. The smallest disturbances that lead to microscopic motion will be sought in an effort to understand how grains move and how forces redistribute under disturbances that lead to settling. This award supports theoretical research on how materials, like paper, crumble and how grains move as granular materials (for example, grains of sand in sandpiles) settle or respond to some disturbance. The PI will use sophisticated mathematical techniques and computer simulations to gain insight into crumpling and granular motion. These processes are important to the understanding of materials and are ubiquitous in our everyday experience. Students and the next generation of researchers will receive high quality educational experiences as the research progresses.

9975533Witten该奖项支持对材料起皱的理论研究。 PI试图扩展以前的工作，找到一个简单的数学描述的个别脊，使一个皱巴巴的表。进一步的工作旨在找到数学关系，确定何时以及如何脊将屈曲。 将研究材料的起皱到越来越小的体积，目的是找到具有普遍性的过程的特征。 主要研究者还将研究颗粒材料（例如沙堆）的包装。使用完全硬的，小的无摩擦球体的数值模拟，PI将研究响应于小扰动而发生的颗粒的微观运动。 将寻求导致微观运动的最小扰动，以了解颗粒如何运动以及在导致沉降的扰动下力如何重新分布。 该奖项支持对材料（如纸张）如何破碎以及颗粒状材料（例如，沙堆中的沙粒）如何移动或对某些干扰做出反应的理论研究。PI将使用复杂的数学技术和计算机模拟来深入了解褶皱和颗粒运动。这些过程对于理解材料非常重要，并且在我们的日常经验中无处不在。学生和下一代研究人员将获得高质量的教育经验，随着研究的进展。