Molecular Design of Polymer Interfaces at the Nanoscale: An Exploratory Study

罗格斯大学他的总体研究建议是通过获得分子信息信息(互扩散机制)和宏观性质(破裂机制)之间的有意义的关系，为设计工程师部分可混溶的聚合物界面提供基础。这些知识将导致聚合物界面的严格和客观的设计。聚合物表面的粘附性在焊接、熔融加工、复合材料层压、增容剂和共混技术、共挤出和裂纹愈合等应用中具有重要的技术意义。所选择的体系是聚苯乙烯/溴化聚苯乙烯(PS/PBS)，这是一种部分相容的共混物，便于在广泛相同的物理化学条件下进行互扩散和断裂测量。第一阶段的研究旨在通过定量了解界面上大分子链的动力学来阐明相互扩散的机制。第二阶段的研究将致力于将从界面动力学研究中获得的分子信息与界面的强度联系起来。PS/PbS样品的断裂能将用改进的双悬臂梁试验与显微镜和电子散斑干涉仪相连接来测量。从这项研究中获得的知识将是合理设计和控制与高性能材料相关的聚合物界面的关键，如生物粘合剂、电子材料和高性能纳米复合材料。

ABSTRACTCTS-9984022Rutgers UniversityThe overall of his research proposal is to provide a basis to design engineer partially miscible polymer interfaces by obtaining meaningful relationships between molecular information information (interdiffusion mechanisms) and macroscopic properties (fracture mechanisms). Such knowledge will lead to rigorous and objective design of polymer interfaces. The adhesion of polymeric surfaces is technologically relevant in applications such as welding, melt processing, composite lamination, compatibilizer and blend technology, co-extrusion, and cracking healing among others.The system chosen is polystyrene/brominated polystyrene (PS/PBS), a partially miscible blend, which lends itself to be conveniently investigated for both interdiffusion and fracture measurements over a wide range of identical physicochemical conditions. The first phase of the research seeks to elucidate the mechanism of interdiffussion by quantitative understanding of the dynamics of macromolecular chains at interfaces.The second component of the research will be directed towards relating the molecular information obtained from interfacial dynamics studies to the strength of the interface. The fracture energy of PS/PBS specimens will be measured using a modified double cantilever beam test interfaced with a tele-miscroscope and an electronic speckle pattern interferometer. The knowledge derived from this research will be pivotal to the rational design and control of polymer interfaces relevant to high performance materials, such as bioadhesives, electronic materials, and high performance nanocomposites.