Micromechanics Associated With Fracture In Integrated Microelectronics

与集成微电子学中断裂相关的微力学

• 批准号: 0070147
• 负责人: David Clarke
• 金额: --
• 依托单位: University of California-Santa Barbara
• 依托单位国家: 美国
• 项目类别: Continuing grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-05-15 至 2005-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0070147&HistoricalAwards=false
• 关键词: Micromechanics; Associated; Fracture; Integrated; Microelectronics

MICRO-MECHANICS ASSOCIATED WITH FRACTURE IN INTEGRATED MICROELECTRONICSThe research addresses two contemporary micro-mechanics issues concerning fracture in microelectronic devices. One is the mechanics of dielectric fracture produced by electromigration in constrained interconnect structures. The other is how stresses accumulate in packaged devices, particularly under thermal cycling conditions, with particular emphasis on conditions of mechanical "shakedown" and "ratcheting" (a condition favoring cracking). The principal experimental tool used in the proposed research will be optical piezospectroscopy, using Raman spectroscopy and photostimulated luminescence. Piezospectroscopy is a developing, non-destructive and non-contact method of strain measurement with a spatial resolution of ~ 1micron when implemented using an optical microprobe.

与综合微电子中的断裂相关的微型力学研究解决了有关微电器设备中裂缝的两个当代微力学问题。一种是电迁移互连结构中电迁移产生的介电裂缝的力学。另一个是如何在包装设备（尤其是在热循环条件下）积累的应力，特别是强调了机械“ shakedown”和“棘轮”的条件（一种有利于开裂的条件）。拟议研究中使用的主要实验工具将使用拉曼光谱和光刺激的发光，是光电谱镜检查。 PiezospectRoscopicy是一种使用光学微探针实施时，具有〜1micron的空间分辨率的应变测量方法的发育，无损和非接触方法。