Micromechanics Associated With Fracture In Integrated Microelectronics

本研究主要针对微电子元件断裂的两个当代微观力学问题。一个是在约束互连结构中由电迁移产生的介电断裂的力学。另一个是应力如何在封装器件中积累，特别是在热循环条件下，特别强调机械“安定”和“棘轮”条件（有利于开裂的条件）。在拟议的研究中使用的主要实验工具将是光学压电光谱，使用拉曼光谱和光激发光。压电光谱是一种发展中的、非破坏性的、非接触的应变测量方法，当使用光学微探针实现时，其空间分辨率为~ 1微米。

MICRO-MECHANICS ASSOCIATED WITH FRACTURE IN INTEGRATED MICROELECTRONICSThe research addresses two contemporary micro-mechanics issues concerning fracture in microelectronic devices. One is the mechanics of dielectric fracture produced by electromigration in constrained interconnect structures. The other is how stresses accumulate in packaged devices, particularly under thermal cycling conditions, with particular emphasis on conditions of mechanical "shakedown" and "ratcheting" (a condition favoring cracking). The principal experimental tool used in the proposed research will be optical piezospectroscopy, using Raman spectroscopy and photostimulated luminescence. Piezospectroscopy is a developing, non-destructive and non-contact method of strain measurement with a spatial resolution of ~ 1micron when implemented using an optical microprobe.