Micro-Mechanics Associated with Interconnects in Integrated Microelectronics

与集成微电子学中互连相关的微机械

• 批准号: 9625796
• 负责人: David Clarke
• 金额: --
• 依托单位: University of California-Santa Barbara
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1996
• 资助国家: 美国
• 起止时间: 1996-09-01 至 1999-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9625796&HistoricalAwards=false
• 关键词: Micro; Mechanics; Associated; Interconnects; Integrated

9625796 Clarke This project is to examine the small scale electronic interconnect damage processes of electromigration voiding and interfacial decohesion which affect the reliability of integrated electronics. These are highly localized phenomena which are affected by temperature (from Joule heating) and stresses. The length scales are much smaller than those of standard mechanics experiments and therefore new experimental techniques are required. The proposed measurements are based on the shift and broadening of both the Raman lines of silicon and the R-line fluorescence of sapphire as a function of temperature and stress. By exciting the spectra with a finely focussed laser the local temperature and stress can be measured. A novel micromechanics test will also be used to measure fracture resistance of interfaces. ***

9625796克拉克这个项目是研究小规模的电子互连损坏过程的电迁移空洞和界面脱粘影响集成电子的可靠性。 这些是高度局部化的现象，受温度（焦耳加热）和应力的影响。 长度尺度比标准力学实验小得多，因此需要新的实验技术。 所提出的测量是基于硅的拉曼线和蓝宝石的R线荧光作为温度和应力的函数的移位和加宽。 通过用细聚焦激光激发光谱，可以测量局部温度和应力。 一种新的微观力学测试也将用于测量界面的断裂阻力。 ***