CAREER: Interaction of Microscale Solidification Fronts with Embedded Particles

职业：微尺度凝固前沿与嵌入颗粒的相互作用

• 批准号: 0092750
• 负责人: Holavanahalli Udaykumar
• 金额: $ 37.5万
• 依托单位: University of Iowa
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2001
• 资助国家: 美国
• 起止时间: 2001-01-01 至 2006-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0092750&HistoricalAwards=false
• 关键词: CAREER; Interaction; Microscale; Solidification; Fronts

This is a very strong proposal in an important field with great potential for impact. Two applications proposed, one to composite materials processing and the other to cryopreservation. The application to cryopreservation is less focused but more exploratory; however, strong collaboration with other investigators in the latter area is noted. May want to consider how to obtain interfacial properties (measured or predicted from microscopic models such as the molecular dynamics method). How to account for asymmetry of dendrites? Two-dimensional modeling may have to evolve to three-D eventually in order to more accurately capture various phenomena.

这是一个重要领域中非常有力的建议，具有很大的影响潜力。提出了两个应用，一个是复合材料加工，另一个是低温保存。冷冻保存的应用不太集中，但更具探索性;然而，在后一领域与其他研究人员的密切合作值得注意。可能需要考虑如何获得界面特性（从微观模型（如分子动力学方法）测量或预测）。如何解释树突的不对称性？二维建模最终可能必须发展到三维，以便更准确地捕捉各种现象。