An Integrated Head for Optically Assisted (Hybrid) Magnetic Recording

ECS-0115836号提案摘要混合记录是一种新的记录模式，旨在克服现有磁和光记录技术的基本物理限制。混合技术结合了热辅助磁写入和巨磁阻读回，以规避磁记录和光记录的物理限制。这种方法打破了磁记录系统中比特大小、写入所需磁场和信息稳定时间之间的耦合。因此，小于10 nm的磁性颗粒可以稳定在介质中，这是达到1太比特/英寸2或更高密度的关键进展。然而，这些进步只有在合理的磁头设计被证明将磁写入极与局部热能源（可能是光学）集成在一起的情况下才有可能。这项技术的一个基本的见解是如何应用磁写场和热量，以及执行MR读回与一个单一的包装设备从单面的磁盘。这是本项目的目标，设计，原型，和测试设备适合这种应用。将被研究的具体新设备将包括二维模式折射率透镜和近场光学天线结构。卡内基梅隆大学（CMU）的数据存储系统中心（DSSC）和GOALI的合作伙伴希捷科技公司在设计和实施新磁头设计方面拥有丰富的经验。磁头制造方面的合作将包括与希捷研究人员的共同设计计划、联合晶圆制造以及现有磁头的制造后修改。预计这一学术-工业合作的结果将是一个用于混合记录的可扩展集成磁头设计的示范，这将消除该技术进步和最终商业化的一个重要障碍。

ABSTRACT for Proposal No. ECS-0115836Hybrid recording is a new recording paradigm that seeks to overcomefundamental physical limits of existing magnetic and optical recordingtechnologies. Hybridization combines thermally assisted magnetic writingwith giant magnetoresistive readback, to circumvent the physical limitsof both magnetic and optical recording. This approach breaks thecoupling seen in magnetic recording systems among the size of a bit, thefield required to write it and the length of time for which theinformation is stable. Thus, magnetic grains in the medium smaller than10 nm can be stabilized, which is a critical advance for reachingdensities of 1 terabit/in2 and beyond. These advances will only bepossible, however, if a plausible head design is demonstrated thatintegrates magnetic write poles with a localized source (probablyoptical) of thermal energy. An essential insight being pursued for thistechnology is how to apply magnetic write fields and heat, as well asperform MR readback with a single packaged device from a single side ofthe disk. It is the goal of this project to design, prototype, and testdevices suitable for this application. Specific novel devices that willbe investigated will include two-dimensional mode-index lenses, andnear-field optical antenna structures. The Data Storage Systems Center(DSSC) at Carnegie Mellon University (CMU) and GOALI collaborator,Seagate Technology, has extensive experience in the design andimplementation of new head designs. The collaboration on headfabrication will include a program of co-design with Seagateresearchers, joint wafer fabrication, and post-fabrication modificationof existing heads. It is anticipated that the result of thisacademic-industrial collaboration will be a demonstration of a plausibleintegrated head design for hybrid recording, which will remove animportant barrier to the advancement and eventual commercialization ofthis technology.