SBIR Phase I: Polysiloxane-Polyimides for Low Temperature Curable Polymer Matrix Materials

SBIR 第一阶段：用于低温固化聚合物基体材料的聚硅氧烷-聚酰亚胺

• 批准号: 0128082
• 负责人: Craig Homrighausen
• 金额: $ 10万
• 依托单位: Eltron Research, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-01-01 至 2002-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0128082&HistoricalAwards=false
• 关键词: SBIR; Phase; Polysiloxane; Polyimides; Low

The Small Business Innovation Research (SBIR) Phase I project addresses the synthesis of new polysiloxane-polyimide co-polymers for use as high-temperature resistant polymeric matrix materials. Phase I will develop new highly usable synthetic methodologies for the production of inorganic-organic hybrid materials composed of cross-linked polysiloxane-polyimide segments. The cross-linking or curing (hydrosilylation) reaction may be conducted at room temperature, thus providing the opportunity to develop a non-autoclave or low-temperature curing system, similar to the well-established room temperature vulcanization process widely used in the silicone industry. The expected high-performance polymeric materials would be employed in Phase II as matrix materials for low-temperature fabrication of polymeric matrix composites (PMC). In Phase II polymer formulation will be optimized, and distinctive PMC components will be fabricated by employing proprietary low-cost resin transfer molding technologies.Commercial applications are expected in low-temperature curable/high-temperature resistant cure-in-place materials. Potential fields of application include automotive components, aeronautics, microelectronics, composites, construction materials, and other industries where outstanding thermal, chemical (solvents and oxidation resistance), physical, and mechanical properties are important.

小企业创新研究（SBIR）第一阶段项目致力于合成新型聚芳醚-聚酰亚胺共聚物，用作耐高温聚合物基体材料。 第一阶段将开发新的高度可用的合成方法，用于生产由交联的聚酰亚胺-聚酰亚胺片段组成的无机-有机杂化材料。 交联或固化（氢化硅烷化）反应可以在室温下进行，从而提供了开发非高压釜或低温固化体系的机会，类似于广泛用于有机硅工业的成熟的室温硫化方法。 预期的高性能聚合物材料将在第二阶段中用作低温制造聚合物基复合材料（PMC）的基体材料。 第二阶段将优化聚合物配方，采用专利的低成本树脂传递模塑技术制造独特的PMC部件，有望在低温固化/耐高温原位固化材料中获得商业应用。 潜在的应用领域包括汽车零部件、航空、微电子、复合材料、建筑材料以及其他需要出色的热、化学（耐溶剂性和抗氧化性）、物理和机械性能的行业。