SBIR Phase II: Innovative Glass Inspection for Advanced Semiconductor Packaging

SBIR 第二阶段：先进半导体封装的创新玻璃检测

基本信息

批准号：
2335175
负责人：
Steven Meeks
金额：
$ 100万
依托单位：
LUMINA INSTRUMENTS INC.
依托单位国家：
美国
项目类别：
Cooperative Agreement
财政年份：
2024
资助国家：
美国
起止时间：
2024-03-15 至 2026-02-28
项目状态：
未结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=2335175&HistoricalAwards=false
关键词：
SBIR Phase II Innovative Glass

项目摘要

The broader/commercial impact of this Small Business Innovation Research (SBIR) Phase II project is to enhance the semiconductor industry. The development of the proposed technology will advance the creation of and reduce the cost of high-quality electronic products such as smartphones, laptops, televisions, AR/VR devices, 5G components, and data storage devices that will be commercially available to individual consumers. This research project will have a substantial societal benefit on the revitalization of the US semiconductor industry by creating more American jobs, boosting national security and reducing the vulnerability of semiconductor devices to tampering and counterfeiting and giving the US a competitive edge in the global market.This Small Business Innovation Research (SBIR) Phase II project will create technology that will advance the creation of high-quality electronic products that will be commercially available to individual consumers. The increasing use of glass panels for semiconductor packaging presents an opportunity to develop technology which will perform full surface inspection of these panels for defects. No nano-particle inspection technology exists for ≥300 mm glass substrates for particles ≤300 nm in diameter, such as those used in advanced semiconductor packaging. The successful development of this highly sensitive process control technology will address these glass inspection pain points, with substantial improvements in yield for semiconductor packaging companies.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这项小型企业创新研究（SBIR）II期项目的广播/商业影响是增强半导体行业。拟议技术的开发将推动创建并降低高质量电子产品的成本，例如智能手机，笔记本电脑，电视，AR/VR设备，5G组件以及数据存储设备，这些设备将可供个人消费者商业使用。该研究项目将通过创造更多的美国工作，促进国家安全并减少半导体设备来篡改和伪造的脆弱性，并降低美国半导体的脆弱性，并使美国在全球市场上具有竞争力的优势，从而使个人创建的产品将成为较高的产品，以至于创造较高的产品，这将使我们的社会利益具有重大的社会利益，从而减少了半导体设备对篡改和伪造的脆弱性，并使美国在全球市场中具有竞争力的优势，这将为我们的小型企业创新研究（SBIR）创建技术的创建能力，以至于创建了这一较高的产品。对半导体包装的玻璃面板的使用越来越多，为开发技术提供了一个机会，该技术将对这些面板进行全面检查。对于直径≤300nm的颗粒，不存在≥300mm玻璃基板的纳米粒子检查技术，例如在晚期半导体包装中使用的颗粒。这种高度敏感的过程控制技术的成功开发将解决这些玻璃检查疼痛点，对半导体包装公司的收益率有了很大的提高。该奖项反映了NSF的法定任务，并通过使用基金会的智力优点和更广泛的影响来评估NSF的法定任务。