SBIR Phase II: Innovative Glass Inspection for Advanced Semiconductor Packaging

SBIR 第二阶段：先进半导体封装的创新玻璃检测

• 批准号: 2335175
• 负责人: Steven Meeks
• 金额: $ 100万
• 依托单位: LUMINA INSTRUMENTS INC.
• 依托单位国家: 美国
• 项目类别: Cooperative Agreement
• 财政年份: 2024
• 资助国家: 美国
• 起止时间: 2024-03-15 至 2026-02-28
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2335175&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Innovative; Glass

The broader/commercial impact of this Small Business Innovation Research (SBIR) Phase II project is to enhance the semiconductor industry. The development of the proposed technology will advance the creation of and reduce the cost of high-quality electronic products such as smartphones, laptops, televisions, AR/VR devices, 5G components, and data storage devices that will be commercially available to individual consumers. This research project will have a substantial societal benefit on the revitalization of the US semiconductor industry by creating more American jobs, boosting national security and reducing the vulnerability of semiconductor devices to tampering and counterfeiting and giving the US a competitive edge in the global market.This Small Business Innovation Research (SBIR) Phase II project will create technology that will advance the creation of high-quality electronic products that will be commercially available to individual consumers. The increasing use of glass panels for semiconductor packaging presents an opportunity to develop technology which will perform full surface inspection of these panels for defects. No nano-particle inspection technology exists for ≥300 mm glass substrates for particles ≤300 nm in diameter, such as those used in advanced semiconductor packaging. The successful development of this highly sensitive process control technology will address these glass inspection pain points, with substantial improvements in yield for semiconductor packaging companies.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这个小型企业创新研究（SBIR）第二阶段项目的更广泛/商业影响是加强半导体行业。 该技术的开发将推动智能手机、笔记本电脑、电视、AR/VR设备、5G组件和数据存储设备等高质量电子产品的开发并降低其成本，这些产品将可供个人消费者购买。 该研究项目将通过创造更多的美国就业机会，对振兴美国半导体产业产生重大的社会效益，提高国家安全，减少半导体设备易受篡改和伪造的脆弱性，使美国在全球市场上具有竞争优势。这个小企业创新研究（SBIR）第二阶段项目将创造技术，促进高科技产品的创造，高质量的电子产品，将在商业上提供给个人消费者。 半导体封装用玻璃面板的使用越来越多，这为开发对这些面板进行全表面缺陷检测的技术提供了机会。 对于直径≤300 nm的≥300 mm玻璃基板，没有纳米颗粒检测技术，例如用于先进半导体封装的纳米颗粒。 这项高灵敏度工艺控制技术的成功开发将解决这些玻璃检测难题，大幅提高半导体封装公司的产量。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。